PACKAGE STRUCTURE

Organization Name

taiwan semiconductor manufacturing company, ltd.

Inventor(s)

Po-Chen Lai of Hsinchu County (TW)

Chin-Hua Wang of New Taipei City (TW)

Ming-Chih Yew of Hsinchu City (TW)

Li-Ling Liao of Hsinchu City (TW)

Tsung-Yen Lee of Changhua County (TW)

Po-Yao Lin of Hsinchu County (TW)

Shin-Puu Jeng of Hsinchu (TW)

PACKAGE STRUCTURE

This abstract first appeared for US patent application 20250070050 titled 'PACKAGE STRUCTURE

Original Abstract Submitted

a package structure is provided. the package structure includes a redistribution structure on a substrate, a semiconductor die on the redistribution structure and electrically connected to the substrate, a wall structure on the redistribution structure and electrically isolated from the substrate. the semiconductor die includes a first sidewall, a second sidewall connected to the first sidewall, and a third sidewall connected to the second sidewall. the wall structure includes a first partition, a second partition and a third partition respectively immediately adjacent to the first sidewall, the second sidewall, and the third sidewall of the semiconductor die. the first partition is located immediately adjacent to and spaced apart from the second partition by a first distance, the second partition is located immediately adjacent to and spaced apart from the third partition by a second distance, and the first distance is substantially equal to the second distance.