Samsung electronics co., ltd. (20250149467). SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
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SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
This abstract first appeared for US patent application 20250149467 titled 'SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
Original Abstract Submitted
a semiconductor package includes a first die structure including a support substrate having a cavity, a first semiconductor chip in the cavity, and a first gap filling layer that fills a gap between an inner wall of the cavity and the first semiconductor chip; and a second die structure on the first die structure, the second die structure including a second semiconductor chip and a second gap filling layer surrounding an outer side surface of the second semiconductor chip. the first semiconductor chip includes a first backside insulating layer with second bonding pads. the second semiconductor chip includes a second front insulating layer with third bonding pads. the second bonding pads and the third bonding pads are directly bonded to each other.