Category:Nitin A. Deshpande of Chandler AZ US
Nitin A. Deshpande
Nitin A. Deshpande from Chandler AZ US has applied for patents in technology areas such as H01L21/56, H01L23/00, H01L23/16 with intel corporation.
Patents
Pages in category "Nitin A. Deshpande of Chandler AZ US"
The following 11 pages are in this category, out of 11 total.
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- Intel corporation (20250006651). SLIT FIDUCIALS FOR INTEGRATED CIRCUIT DEVICE ALIGNMENT
- Intel corporation (20250006652). FIDUCIALS WITH UNDERLYING DUMMY METALLIZATION FOR INTEGRATED CIRCUIT DEVICE ALIGNMENT
- Intel corporation (20250006653). FIDUCIALS WITH ASSOCIATED LOW-DENSITY METAL ZONES
- Intel corporation (20250006695). PACKAGING ARCHITECTURE INCLUDING COMPENSATION LAYERS FOR WAFER-SCALE KNOWN-GOOD-DIE TO KNOWN-GOOD-DIE HYBRID BONDING
- Intel corporation (20250096009). LOW COST PACKAGE WARPAGE SOLUTION
- Intel corporation (20250112168). HYBRID BONDING WITH EMBEDDED ALIGNMENT MARKERS
- Intel corporation (20250112205). DIE-TO-DIE INPUT/OUTPUT SIGNAL ROUTING UTILIZING OPPOSING DIE SURFACES IN INTEGRATED CIRCUIT COMPONENT PACKAGING