18961031. LOW COST PACKAGE WARPAGE SOLUTION (Intel Corporation)
LOW COST PACKAGE WARPAGE SOLUTION
Organization Name
Inventor(s)
Omkar G. Karhade of Chandler AZ US
Nitin A. Deshpande of Chandler AZ US
Debendra Mallik of Chandler AZ US
Bassam M. Ziadeh of Gilbert AZ US
Yoshihiro Tomita of Tsukuba-shi JP
LOW COST PACKAGE WARPAGE SOLUTION
This abstract first appeared for US patent application 18961031 titled 'LOW COST PACKAGE WARPAGE SOLUTION
Original Abstract Submitted
Embodiments of the invention include device packages and methods of forming such packages. In an embodiment, the method of forming a device package may comprise forming a reinforcement layer over a substrate. One or more openings may be formed through the reinforcement layer. In an embodiment, a device die may be placed into one of the openings. The device die may be bonded to the substrate by reflowing one or more solder bumps positioned between the device die and the substrate. Embodiments of the invention may include a molded reinforcement layer. Alternative embodiments include a reinforcement layer that is adhered to the surface of the substrate with an adhesive layer.