18823171. FAN-OUT LEVEL SEMICONDUCTOR PACKAGE (SAMSUNG ELECTRONICS CO., LTD.)
FAN-OUT LEVEL SEMICONDUCTOR PACKAGE
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FAN-OUT LEVEL SEMICONDUCTOR PACKAGE
This abstract first appeared for US patent application 18823171 titled 'FAN-OUT LEVEL SEMICONDUCTOR PACKAGE
Original Abstract Submitted
A semiconductor package includes a first wiring structure, an extension structure disposed on the first wiring structure, including an extension base layer and a plurality of via structures, and having a mounting space passing through the extension base layer. The plurality of via structures include a plurality of via connection patterns, a semiconductor chip disposed in the mounting space and electrically connected to the first wiring structure, a filling insulating layer filling the mounting space, and a second wiring structure disposed on the extension structure and the filling insulating layer and electrically connected to the first wiring structure. Lowermost via connection patterns, among the plurality of via connection patterns, include a plurality of first lower connection pads, and the extension base layer includes base dams respectively passing through the plurality of first lower connection pads.