SEMICONDUCTOR PACKAGES INCLUDING DAM STRUCTURES

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SEMICONDUCTOR PACKAGES INCLUDING DAM STRUCTURES

This abstract first appeared for US patent application 20250062167 titled 'SEMICONDUCTOR PACKAGES INCLUDING DAM STRUCTURES

Original Abstract Submitted

a semiconductor package includes a substrate including lower pads and a vent hole, a semiconductor chip, an encapsulant including a through-portion filling the vent hole and an extension disposed adjacent to the through-portion, and a ground plate and a power plate disposed on a lower surface of the substrate. the lower surface of the substrate includes a first region including the vent hole, a pad region including the lower pads, and a second region between the first region and the pad region. the extension extends in a first horizontal direction in the first region. the ground plate and the power plate include at least one first protrusion disposed in the second region and extending in the first horizontal direction and at least one second protrusion extending in an opposite direction, respectively. the at least one first protrusion is disposed to engage with the at least one second protrusion.