Texas instruments incorporated (20250006573). OPEN CAVITY SENSOR
OPEN CAVITY SENSOR
Organization Name
texas instruments incorporated
Inventor(s)
[[:Category:Maricel Fabia Esca�o of Angeles City PH|Maricel Fabia Esca�o of Angeles City PH]][[Category:Maricel Fabia Esca�o of Angeles City PH]]
Katleen Fajardo Timbol of Allen TX US
Jeffrey Salvacion Solas of Iloilo City PH
OPEN CAVITY SENSOR
This abstract first appeared for US patent application 20250006573 titled 'OPEN CAVITY SENSOR
Original Abstract Submitted
in examples, a semiconductor package comprises a semiconductor die including a device side having circuitry formed therein. the device side includes a sensor. the package includes a metal member creating a hollow cavity extending through the metal member, the hollow cavity vertically aligned with the sensor, the metal member including a lower portion having a first wall thickness and an upper portion having varying wall thicknesses greater than and less than the first wall thickness, an intersection of the upper and lower portions forming a notch on an outer side of the metal member opposing the hollow cavity. the package also includes a mold compound covering portions of the semiconductor die and contacting the metal member.