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Category:Chandra Mohan Jha of Tempe AZ US

From WikiPatents

Chandra Mohan Jha

Chandra Mohan Jha from Tempe AZ US has applied for patents in technology areas such as H01L23/00, H01L23/16, H01L23/367 with intel corporation.

Patents

MICROELECTRONIC PACKAGE WITH SOLDER ARRAY THERMAL INTERFACE MATERIAL (SA-TIM) (20250096178)

Pages in category "Chandra Mohan Jha of Tempe AZ US"

The following 2 pages are in this category, out of 2 total.

1

18969889. MICROELECTRONIC PACKAGE WITH SOLDER ARRAY THERMAL INTERFACE MATERIAL (SA-TIM) (Intel Corporation)

I

Intel corporation (20250096178). MICROELECTRONIC PACKAGE WITH SOLDER ARRAY THERMAL INTERFACE MATERIAL (SA-TIM)

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