Category:Debendra Mallik of Chandler AZ US
Debendra Mallik
Debendra Mallik from Chandler AZ US has applied for patents in technology areas such as H01L21/56, H01L23/00, H01L23/16 with intel corporation.
Patents
Pages in category "Debendra Mallik of Chandler AZ US"
The following 7 pages are in this category, out of 7 total.
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- Intel corporation (20250006643). METHODS OF FORMING WAFER LEVEL MULTI-DIE SYSTEM FABRIC INTERCONNECT STRUCTURES
- Intel corporation (20250096009). LOW COST PACKAGE WARPAGE SOLUTION
- Intel corporation (20250096178). MICROELECTRONIC PACKAGE WITH SOLDER ARRAY THERMAL INTERFACE MATERIAL (SA-TIM)
- Intel corporation (20250118647). NESTED INTERPOSER WITH THROUGH-SILICON VIA BRIDGE DIE