19018792. COVERS FOR SEMICONDUCTOR PACKAGE COMPONENTS (TEXAS INSTRUMENTS INCORPORATED)
COVERS FOR SEMICONDUCTOR PACKAGE COMPONENTS
Organization Name
TEXAS INSTRUMENTS INCORPORATED
Inventor(s)
Sreenivasan Kalyani Koduri of Allen TX US
Leslie Edward Stark of Heath TX US
COVERS FOR SEMICONDUCTOR PACKAGE COMPONENTS
This abstract first appeared for US patent application 19018792 titled 'COVERS FOR SEMICONDUCTOR PACKAGE COMPONENTS
Original Abstract Submitted
In some examples, a semiconductor package comprises a semiconductor die; an operational component on an active surface of the semiconductor die; and a cover coupled to the active surface of the semiconductor die and covering the operational component. The cover comprises a monolithic structure including a vertical portion and a horizontal portion. A hollow area is between the cover and the operational component. The package also includes a mold compound covering the semiconductor die and the cover.