There is currently no text in this page. You can search for this page title in other pages, or search the related logs, but you do not have permission to create this page.
Category:H01L23/473
Jump to navigation
Jump to search
Pages in category "H01L23/473"
The following 38 pages are in this category, out of 38 total.
1
- 17455949. DOUBLE PATTERNED MICROCOOLER HAVING ALTERNATING FIN WIDTHS simplified abstract (International Business Machines Corporation)
- 17808221. ELECTROMAGNETIC WAVEGUIDING THROUGH LIQUID COOLING CONDUIT simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 17809128. Cooling Cover and Packaged Semiconductor Device Including the Same simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 17826505. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17877041. 3D High Bandwidth Memory and Optical Connectivity Stacking simplified abstract (GOOGLE LLC)
- 17932765. ELECTROMAGNETIC SHIELD OF AN INTEGRATED CIRCUIT PACKAGE simplified abstract (HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP)
- 17957403. HIGH PERFORMANCE PERMANENT GLASS ARCHITECTURES FOR STACKED INTEGRATED CIRCUIT DEVICES simplified abstract (Intel Corporation)
- 17961371. SEMICONDUCTOR PACKAGE AND COOLING SYSTEM simplified abstract (Samsung Electronics Co., Ltd.)
- 18034133. TECHNOLOGIES FOR ISOLATED HEAT DISSIPATING DEVICES simplified abstract (Intel Corporation)
- 18133276. POWER DEVICE AND METHOD OF MANUFACTURING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18149793. Integrated Circuit Packages and Methods of Forming the Same simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18403763. SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18453026. CHIP PROTECTION DEVICE simplified abstract (Samsung Electronics Co., Ltd.)
2
- 20240014101. MICROFLUIDIC CHANNELS SEALED WITH DIRECTIONALLY-GROWN PLUGS simplified abstract (GlobalFoundries U.S. Inc.)
- 20240038633. EMBEDDED COOLING SYSTEMS AND METHODS OF MANUFACTURING EMBEDDED COOLING SYSTEMS simplified abstract (Invensas Bonding Technologies, Inc.)
- 20240047304. JET IMPINGEMENT COOLING WITH BYPASS FLUID PORTION FOR HIGH POWER SEMICONDUCTOR DEVICES simplified abstract (SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC)
B
- Blockchain patent applications on 22nd Mar 2024
- Blockchain patent applications on April 11th, 2024
- Blockchain patent applications on February 1st, 2024
- Blockchain patent applications on February 22nd, 2024
- Blockchain patent applications on February 8th, 2024
- Blockchain patent applications on January 11th, 2024
- Blockchain patent applications on March 21st, 2024
D
I
- Intel corporation (20240105582). LOW TEMPERATURE CAPACITIVELY COUPLED DEVICE FOR LOW NOISE CIRCUITS simplified abstract
- Intel corporation (20240113087). HIGH PERFORMANCE PERMANENT GLASS ARCHITECTURES FOR STACKED INTEGRATED CIRCUIT DEVICES simplified abstract
- Intel Corporation patent applications on April 4th, 2024
- Intel Corporation patent applications on January 25th, 2024
- Intel Corporation patent applications on March 28th, 2024
S
T
- Taiwan semiconductor manufacturing company, ltd. (20240136251). SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF simplified abstract
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on April 25th, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on March 14th, 2024