Delphi technologies ip limited (20240105553). SYSTEMS AND METHODS FOR ACTIVE AND PASSIVE COOLING OF ELECTRICAL COMPONENTS simplified abstract
Contents
- 1 SYSTEMS AND METHODS FOR ACTIVE AND PASSIVE COOLING OF ELECTRICAL COMPONENTS
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SYSTEMS AND METHODS FOR ACTIVE AND PASSIVE COOLING OF ELECTRICAL COMPONENTS - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
SYSTEMS AND METHODS FOR ACTIVE AND PASSIVE COOLING OF ELECTRICAL COMPONENTS
Organization Name
delphi technologies ip limited
Inventor(s)
Kevin M. Gertiser of Carmel IN (US)
SYSTEMS AND METHODS FOR ACTIVE AND PASSIVE COOLING OF ELECTRICAL COMPONENTS - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240105553 titled 'SYSTEMS AND METHODS FOR ACTIVE AND PASSIVE COOLING OF ELECTRICAL COMPONENTS
Simplified Explanation
The method described in the abstract involves sintering a fin system to a base substrate, sintering power switch components to the base substrates, and soldering a heat dissipation element to one of the base substrates.
- Sintering a fin system to a first base substrate
- Sintering power switch components to the base substrates
- Soldering a heat dissipation element to the second base substrate
Potential Applications
This technology could be applied in power modules for various electronic devices, such as inverters, converters, and motor drives.
Problems Solved
This method provides a reliable and efficient way to mount a fin system in a power module, ensuring proper heat dissipation and component integration.
Benefits
- Improved thermal management - Enhanced power module performance - Simplified manufacturing process
Potential Commercial Applications
This technology could be utilized in the automotive industry for electric vehicles, as well as in industrial applications for power electronics.
Possible Prior Art
One possible prior art could be the use of traditional soldering techniques for mounting fin systems in power modules. However, the sintering process described in this patent application offers advantages in terms of reliability and efficiency.
Unanswered Questions
How does this method compare to traditional soldering techniques for mounting fin systems in power modules?
The article does not provide a direct comparison between the sintering method described and traditional soldering techniques in terms of efficiency, reliability, and cost-effectiveness.
What specific types of electronic devices could benefit the most from this technology?
The article does not specify which types of electronic devices would see the most significant improvements from the implementation of this mounting method.
Original Abstract Submitted
a method for mounting a fin system in a power module includes: sintering a fin system to a first base substrate, the fin system comprising a plurality of fins attached to and extending away from a base plate; sintering a first power switch component to the first base substrate; sintering a second power switch component to a second base substrate; and soldering a heat dissipation element to the second base substrate.
