Samsung electronics co., ltd. (20240096748). CHIP PROTECTION DEVICE simplified abstract
Contents
- 1 CHIP PROTECTION DEVICE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 CHIP PROTECTION DEVICE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
CHIP PROTECTION DEVICE
Organization Name
Inventor(s)
Gyuhyeong Kim of Suwon-si (KR)
Seunghwan Kim of Suwon-si (KR)
CHIP PROTECTION DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240096748 titled 'CHIP PROTECTION DEVICE
Simplified Explanation
The chip protection device described in the patent application is a frame that surrounds the side surfaces of a semiconductor chip mounted on a substrate. The frame includes side walls and upper walls, with apertures for fluid flow to transfer heat away from the chip.
- The protection frame surrounds the side surfaces of a semiconductor chip.
- The frame includes side walls and upper walls to create an inner space.
- Apertures in the frame allow fluid to enter and exit the inner space.
- Heat from the chip is transferred to the fluid in the inner space.
Potential Applications
The technology could be applied in:
- Electronic devices
- Automotive systems
- Industrial machinery
Problems Solved
This technology helps to:
- Prevent overheating of semiconductor chips
- Improve overall performance and longevity of electronic devices
Benefits
The benefits of this technology include:
- Enhanced thermal management
- Increased reliability of electronic components
- Improved efficiency of electronic systems
Potential Commercial Applications
This technology could be used in:
- Consumer electronics
- Automotive electronics
- Industrial automation systems
Possible Prior Art
One possible prior art for this technology could be:
- Heat sinks attached directly to semiconductor chips
Unanswered Questions
How does the fluid flow through the apertures in the protection frame?
The fluid flows through the apertures due to pressure differentials created within the inner space of the frame.
What types of fluids can be used in this system?
Various types of fluids, such as water or coolants, can be used depending on the specific application requirements.
Original Abstract Submitted
a chip protection device includes a protection frame extending around side surfaces of a semiconductor chip mounted on a substrate. the protection frame includes a plurality of side walls, each wall facing and spaced apart from a respective side surface of the semiconductor chip, and a plurality of upper walls, each upper wall extending inward from an upper portion of a respective side wall toward the semiconductor chip. a plurality of apertures are formed through the side walls and through which a fluid enters and exits. the protection frame defines an inner space in which the fluid can flow via the plurality of apertures. heat from the side surfaces of the semiconductor chip is transferred to the fluid in the inner space.
