18149793. Integrated Circuit Packages and Methods of Forming the Same simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
Integrated Circuit Packages and Methods of Forming the Same
Organization Name
Taiwan Semiconductor Manufacturing Company, Ltd.
Inventor(s)
Wensen Hung of Zhubei City (TW)
Wen-Hsin Wei of Hsinchu City (TW)
Hsien-Pin Hu of Zhubei City (TW)
Integrated Circuit Packages and Methods of Forming the Same - A simplified explanation of the abstract
This abstract first appeared for US patent application 18149793 titled 'Integrated Circuit Packages and Methods of Forming the Same
Simplified Explanation
The abstract describes a method for attaching package components to a package substrate, including the use of an interposer, multiple dies, encapsulant, thermal interface material, and a lid structure with lid cap and lid feet forming a discontinuous loop.
- Package components are attached to a package substrate using an interposer.
- The package components include multiple dies and encapsulant.
- Thermal interface material is attached to the dies.
- A lid structure with a lid cap and lid feet is attached to the package substrate, forming a discontinuous loop around the package components.
Potential Applications
This technology can be applied in semiconductor packaging, electronic devices, and integrated circuits.
Problems Solved
This method solves the problem of efficiently attaching and protecting multiple dies in a package component.
Benefits
The benefits of this technology include improved thermal management, enhanced protection for the dies, and increased reliability of the package components.
Original Abstract Submitted
In an embodiment, a method includes: attaching a package component to a package substrate, the package component includes: a first die being disposed over an interposer; a second die being disposed over the interposer and laterally adjacent to the first die; and an encapsulant being disposed around the first die and the second die; attaching a thermal interface material to the first die and the second die; and attaching a lid structure to the package substrate, the lid structure includes: a lid cap being disposed over the thermal interface material; and a plurality of lid feet connecting the lid cap to the package substrate, in a plan view the plurality of lid feet forming a discontinuous loop around the package component.
