17961371. SEMICONDUCTOR PACKAGE AND COOLING SYSTEM simplified abstract (Samsung Electronics Co., Ltd.)
Contents
SEMICONDUCTOR PACKAGE AND COOLING SYSTEM
Organization Name
Inventor(s)
TAEHWAN Kim of HWASEONG-SI (KR)
EUNGCHANG Lee of HANAM-SI (KR)
SUNGEUN Jo of HWASEONG-SI (KR)
SEMICONDUCTOR PACKAGE AND COOLING SYSTEM - A simplified explanation of the abstract
This abstract first appeared for US patent application 17961371 titled 'SEMICONDUCTOR PACKAGE AND COOLING SYSTEM
Simplified Explanation
The abstract describes a semiconductor package that includes various components such as a package substrate, interposer, semiconductor chips, molding member, sealing member, and a heat dissipation member. The heat dissipation member consists of a lower structure in contact with the package substrate and an upper structure with a microchannel and a micropillar.
- The semiconductor package includes a package substrate, interposer, semiconductor chips, molding member, sealing member, and heat dissipation member.
- The heat dissipation member has a lower structure in contact with the package substrate and an upper structure.
- The upper structure extends over the sealing member and includes a microchannel and a micropillar.
Potential applications of this technology:
- Electronic devices: The semiconductor package can be used in various electronic devices such as smartphones, tablets, laptops, and gaming consoles.
- Automotive industry: The technology can be applied in automotive electronics, enabling efficient heat dissipation in components like engine control units and infotainment systems.
- Industrial applications: The semiconductor package can be utilized in industrial equipment and machinery, ensuring reliable performance and thermal management.
Problems solved by this technology:
- Heat dissipation: The heat dissipation member with the microchannel and micropillar design helps in efficiently dissipating heat generated by the semiconductor chips, preventing overheating and potential damage.
- Package reliability: The various components of the semiconductor package, along with the heat dissipation member, work together to enhance the reliability and longevity of the package, reducing the risk of failure.
Benefits of this technology:
- Improved performance: Efficient heat dissipation ensures that the semiconductor chips operate at optimal temperatures, leading to improved performance and reliability.
- Compact design: The integration of various components and the microchannel/micropillar structure in the heat dissipation member allows for a compact and space-saving design of the semiconductor package.
- Enhanced reliability: The combination of different elements in the package, along with effective heat dissipation, contributes to increased reliability and longevity of the semiconductor package.
Original Abstract Submitted
A semiconductor package includes; a package substrate, an interposer disposed on the package substrate, semiconductor chips mounted on the interposer, a molding member on the interposer and surrounding the semiconductor chips, a first sealing member on the molding member, and a heat dissipation member on the package substrate and covering the interposer, the semiconductor chips, and the first sealing member, wherein the heat dissipation member includes a lower structure contacting an upper surface of the package substrate, and an upper structure on the lower structure, extending over the first sealing member, and including a microchannel and a micropillar on the microchannel.
