20240047304. JET IMPINGEMENT COOLING WITH BYPASS FLUID PORTION FOR HIGH POWER SEMICONDUCTOR DEVICES simplified abstract (SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC)

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JET IMPINGEMENT COOLING WITH BYPASS FLUID PORTION FOR HIGH POWER SEMICONDUCTOR DEVICES

Organization Name

SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor(s)

John Mookken of Scottsdale AZ (US)

JET IMPINGEMENT COOLING WITH BYPASS FLUID PORTION FOR HIGH POWER SEMICONDUCTOR DEVICES - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240047304 titled 'JET IMPINGEMENT COOLING WITH BYPASS FLUID PORTION FOR HIGH POWER SEMICONDUCTOR DEVICES

Simplified Explanation

The abstract describes a jet impingement cooling assembly for semiconductor devices. It consists of an inlet chamber that receives an inlet fluid flow, and a jet plate with multiple jet nozzles connected to the inlet chamber. The jet plate directs a portion of the inlet fluid flow through the jet nozzles. The assembly also includes an outlet chamber that receives the jet fluid portion after it passes through the jet nozzles. Additionally, there is at least one bypass nozzle connected to the inlet chamber, which directs a bypass fluid portion of the inlet fluid flow into the outlet chamber along with the jet fluid portion, creating an outlet fluid flow.

  • The assembly is designed to cool semiconductor devices using a jet impingement cooling technique.
  • It includes an inlet chamber to receive the fluid flow and a jet plate with jet nozzles to direct a portion of the fluid flow onto the devices.
  • An outlet chamber collects the fluid after it has passed through the jet nozzles.
  • A bypass nozzle is used to direct a portion of the fluid flow into the outlet chamber, creating an outlet fluid flow.
  • The assembly provides efficient cooling for semiconductor devices, preventing overheating and potential damage.

Potential applications of this technology:

  • Cooling of semiconductor devices in electronic devices such as computers, smartphones, and servers.
  • Cooling of high-power electronic components in automotive systems.
  • Cooling of power electronics in renewable energy systems.

Problems solved by this technology:

  • Overheating of semiconductor devices, which can lead to reduced performance and potential damage.
  • Inadequate cooling methods that cannot effectively dissipate heat from high-power electronic components.
  • Thermal management challenges in electronic devices with limited space for cooling systems.

Benefits of this technology:

  • Improved cooling efficiency and heat dissipation for semiconductor devices.
  • Enhanced performance and reliability of electronic devices.
  • Compact and space-saving design for cooling systems.
  • Potential for increased lifespan and durability of semiconductor devices.


Original Abstract Submitted

a jet impingement cooling assembly for semiconductor devices includes an inlet chamber configured to receive an inlet fluid flow, and a jet plate having a plurality of jet nozzles formed therein and coupled to the inlet chamber, and positioned to direct a jet fluid portion of the inlet fluid flow from the inlet chamber through the jet nozzles. the jet impingement cooling assembly may further include an outlet chamber positioned to receive the jet fluid portion once the jet fluid portion has passed through the jet nozzles, and at least one bypass nozzle in fluid connection with the inlet chamber and configured to direct a bypass fluid portion of the inlet fluid flow into the outlet chamber with the jet fluid portion to thereby define an outlet fluid flow.

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