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Category:G03F7/11
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This category has the following 43 subcategories, out of 43 total.
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Pages in category "G03F7/11"
The following 78 pages are in this category, out of 78 total.
1
- 17733743. METHOD FOR FORMING PHOTORESIST PATTERNS simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17734772. RESIST TOPCOAT COMPOSITION, AND METHOD OF FORMING PATTERNS USING THE COMPOSITION simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17749899. RESIST TOPCOAT COMPOSITION, AND METHOD OF FORMING PATTERNS USING THE COMPOSITION simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17847794. METHOD FOR FORMING PHOTORESIST PATTERNS simplified abstract (Samsung Electronics Co., Ltd.)
- 17858921. COMPOSITION FOR REMOVING EDGE BEADS FROM METAL CONTAINING RESISTS, AND METHOD OF FORMING PATTERNS INCLUDING STEP OF REMOVING EDGE BEADS USING THE COMPOSITION simplified abstract (Samsung Electronics Co., Ltd.)
- 18271390. RESIST UNDERLAYER FILM-FORMING COMPOSITION CONTAINING POLYMER HAVING ALICYCLIC HYDROCARBON GROUP simplified abstract (NISSAN CHEMICAL CORPORATION)
- 18281993. NAPHTHALENE UNIT-CONTAINING RESIST UNDERLAYER FILM-FORMING COMPOSITION simplified abstract (NISSAN CHEMICAL CORPORATION)
- 18285141. COMPOSITION FOR FORMING SILICON-CONTAINING UNDERLAYER FILM FOR INDUCED SELF-ORGANIZATION simplified abstract (NISSAN CHEMICAL CORPORATION)
- 18347634. METHOD OF PREVENTING PATTERN COLLAPSE (Tokyo Electron Limited)
- 18359391. ON-PRESS DEVELOPMENT TYPE LITHOGRAPHIC PRINTING PLATE PRECURSOR, METHOD OF PREPARING LITHOGRAPHIC PRINTING PLATE, AND LITHOGRAPHIC PRINTING METHOD simplified abstract (FUJIFILM Corporation)
- 18375031. SWITCHABLE UNDERLAYERS FOR EUV LITHOGRAPHY (INTEL CORPORATION)
- 18379106. EUV PHOTORESIST AND UNDERLAYER ADHESION MODULATION simplified abstract (Applied Materials, Inc.)
- 18387619. METHOD TO PATTERN A SEMICONDUCTOR SUBSTRATE USING A MULTILAYER PHOTORESIST FILM STACK (Tokyo Electron Limited)
- 18404434. PHOTORESIST UNDERLAYER MATERIALS AND ASSOCIATED METHODS (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18419879. HARDMASK COMPOSITION, HARDMASK LAYER AND METHOD OF FORMING PATTERNS simplified abstract (Samsung SDI Co., Ltd.)
- 18427044. PHOTOLITHOGRAPHY METHOD AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME (SAMSUNG ELECTRONICS CO., LTD.)
- 18447673. PHOTORESIST TOP COATING MATERIAL FOR ETCHING RATE CONTROL simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18479181. SPIN-ON ADHESION PROMOTER COMPOSITION AND METHOD FOR HIGH NUMERICAL APERTURE EXTREME ULTRAVIOLET LITHOGRAPHY (International Business Machines Corporation)
- 18520093. METHODS FOR MAKING FLOW CELLS simplified abstract (ILLUMINA, INC.)
- 18578627. METHOD OF FORMING PATTERNS simplified abstract (Samsung SDI Co., Ltd.)
- 18588447. Resist Underlayer Film Material, Pattern Forming Method, And Method Of Forming Resist Underlayer Film simplified abstract (SHIN-ETSU CHEMICAL CO., LTD.)
- 18597316. Material For Forming Adhesive Film, Patterning Process, And Method For Forming Adhesive Film simplified abstract (SHIN-ETSU CHEMICAL CO., LTD.)
- 18599666. HARDMASK COMPOSITION, HARDMASK LAYER AND METHOD OF FORMING PATTERNS simplified abstract (Samsung SDI Co., Ltd.)
- 18601541. Method For Forming Resist Underlayer Film And Patterning Process simplified abstract (SHIN-ETSU CHEMICAL CO., LTD.)
- 18615313. FORMATION OF SUB-LITHOGRAPHIC MANDREL PATTERNS USING REVERSIBLE OVERCOAT (Tokyo Electron Limited)
- 18626242. RESIST UNDERLAYER COMPOSITION (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18663843. METHOD OF REDUCING UNDESIRED LIGHT INFLUENCE IN EXTREME ULTRAVIOLET EXPOSURE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18740139. STRUCTURES FOR PATTERNING AND RELATED METHODS AND SYSTEMS (ASM IP Holding B.V.)
- 18743005. THICK FILM-FORMING COMPOSITION AND METHOD FOR MANUFACTURING CURED FILM USING THE SAME simplified abstract (Merck Patent GmbH)
- 18776047. RESIST UNDERLAYER COMPOSITION AND METHOD OF FORMING PATTERNS USING THE COMPOSITION (SAMSUNG SDI CO., LTD.)
- 18817618. Compound For Forming Metal-Containing Film, Composition For Forming Metal-Containing Film, And Patterning Process (Shin-Etsu Chemical Co., Ltd.)
- 18885477. WATER SOLUBLE PROTECTIVE COATINGS FOR ENGINEERED OPTICAL DEVICES (Applied Materials, Inc.)
- 18893066. Composition For Forming Metal-Containing Film And Patterning Process (SHIN-ETSU CHEMICAL CO., LTD.)
- 18908930. Composition For Forming Resist Underlayer Film, Resist Underlayer Film, Method For Manufacturing Resist Underlayer Film, Patterning Process, And Method For Manufacturing Semiconductor Device (SHIN-ETSU CHEMICAL CO., LTD.)
- 18912771. COMPOSITION FOR FORMING ORGANIC FILM, METHOD FOR FORMING ORGANIC FILM, PATTERNING PROCESS, AND POLYMER (SHIN-ETSU CHEMICAL CO., LTD.)
- 18941798. METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE (Taiwan Semiconductor Manufacturing Company, LTD.)
- 19010913. Lithography Process and Material for Negative Tone Development (Taiwan Semiconductor Manufacturing Company, Ltd.)
A
I
- Intel corporation (20250110408). SWITCHABLE UNDERLAYERS FOR EUV LITHOGRAPHY
- Intel Corporation patent applications on April 3rd, 2025
- INTEL CORPORATION patent applications on April 3rd, 2025
- International business machines corporation (20250110409). SPIN-ON ADHESION PROMOTER COMPOSITION AND METHOD FOR HIGH NUMERICAL APERTURE EXTREME ULTRAVIOLET LITHOGRAPHY
- International Business Machines Corporation patent applications on April 3rd, 2025
S
- Samsung electronics co., ltd. (20240411227). PHOTOLITHOGRAPHY METHOD AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME
- Samsung Electronics Co., Ltd. patent applications on December 12th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on December 12th, 2024
- Samsung sdi co., ltd. (20240319601). METHOD OF FORMING PATTERNS simplified abstract
- Samsung sdi co., ltd. (20240319602). HARDMASK COMPOSITION, HARDMASK LAYER AND METHOD OF FORMING PATTERNS simplified abstract
- Samsung sdi co., ltd. (20250068076). RESIST UNDERLAYER COMPOSITION AND METHOD OF FORMING PATTERNS USING THE COMPOSITION
- SAMSUNG SDI CO., LTD. patent applications on February 27th, 2025
- SAMSUNG SDI CO., LTD. patent applications on February 6th, 2025
- SAMSUNG SDI CO., LTD. patent applications on March 6th, 2025
- Samsung SDI Co., Ltd. patent applications on September 26th, 2024
- Shin-etsu chemical co., ltd. (20240337944). Resist Underlayer Film Material, Pattern Forming Method, And Method Of Forming Resist Underlayer Film simplified abstract
- SHIN-ETSU CHEMICAL CO., LTD. patent applications on October 10th, 2024
T
- Taiwan semiconductor manufacturing co., ltd. (20240192601). PHOTORESIST TOP COATING MATERIAL FOR ETCHING RATE CONTROL simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20250085631). PHOTORESIST UNDERLAYER MATERIALS AND ASSOCIATED METHODS
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on June 13th, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on March 13th, 2025
- Taiwan semiconductor manufacturing company, ltd. (20240295820). METHOD OF REDUCING UNDESIRED LIGHT INFLUENCE IN EXTREME ULTRAVIOLET EXPOSURE simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240377743). BOTTOM ANTIREFLECTIVE COATING MATERIALS simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20250068075). METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
- Taiwan semiconductor manufacturing company, ltd. (20250130499). RESIST UNDERLAYER COMPOSITION
- Taiwan semiconductor manufacturing company, ltd. (20250138428). Lithography Process and Material for Negative Tone Development
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. patent applications on April 24th, 2025
- Taiwan Semiconductor Manufacturing Company, LTD. patent applications on February 27th, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on May 1st, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on November 14th, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on September 5th, 2024
- Tokyo electron limited (20250149335). METHOD TO PATTERN A SEMICONDUCTOR SUBSTRATE USING A MULTILAYER PHOTORESIST FILM STACK
- Tokyo Electron Limited patent applications on May 8th, 2025
U
- US Patent Application 18232717. PHOTORESIST UNDER-LAYER AND METHOD OF FORMING PHOTORESIST PATTERN simplified abstract
- US Patent Application 18232758. METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES simplified abstract
- US Patent Application 18361402. BOTTOM ANTIREFLECTIVE COATING MATERIALS simplified abstract
- US Patent Application 18361878. PATTERN FIDELITY ENHANCEMENT simplified abstract