17733743. METHOD FOR FORMING PHOTORESIST PATTERNS simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)

METHOD FOR FORMING PHOTORESIST PATTERNS

Organization Name

SAMSUNG ELECTRONICS CO., LTD.

Inventor(s)

Ran Namgung of Suwon-si (KR)

Shinhyo Bae of Suwon-si (KR)

Hyeon Park of Suwon-si (KR)

Daeseok Song of Suwon-si (KR)

Minki Chon of Suwon-si (KR)

Jun Soo Kim of Hwaseong-si (KR)

Hyun-Woo Kim of Seongnam-si (KR)

Hyun-Ji Song of Anyang-si (KR)

Young Joo Choi of Hwaseong-si (KR)

Suk-Koo Hong of Hwaseong-si (KR)

METHOD FOR FORMING PHOTORESIST PATTERNS - A simplified explanation of the abstract

This abstract first appeared for US patent application 17733743 titled 'METHOD FOR FORMING PHOTORESIST PATTERNS

Simplified Explanation

The patent application describes a method for forming a photoresist pattern on a substrate and a semiconductor device using the same. The method involves several steps including coating an organic topcoat composition on the photoresist pattern, drying and heating the substrate to form a topcoat, and removing the topcoat using a rinse solution.

• The method involves forming a photoresist pattern on a substrate.
• An organic topcoat composition is coated on the photoresist pattern.
• The substrate is dried and heated to form a topcoat.
• A rinse solution is sprayed on the substrate to remove the topcoat.

Potential applications of this technology:

• Semiconductor manufacturing
• Electronics industry

Problems solved by this technology:

• Provides a method for forming a photoresist pattern on a substrate.
• Helps in improving the quality and precision of semiconductor devices.

Benefits of this technology:

• Allows for the formation of precise and high-quality photoresist patterns.
• Enhances the performance and reliability of semiconductor devices.
• Simplifies the manufacturing process by providing a method for removing the topcoat.

Original Abstract Submitted

A method of forming a photoresist pattern and a semiconductor device on which a photoresist pattern manufactured according to the same is formed. The method includes forming a photoresist pattern on a substrate; coating an organic topcoat composition including an acrylic polymer including a structural unit containing a hydroxy group and a fluorine and an acidic compound on the photoresist pattern; drying and heating the substrate on which the organic topcoat composition is coated to coat it with a topcoat; and spraying a rinse solution including an ether-based compound on the substrate coated with the topcoat to remove the topcoat.