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Category:G02B6/43
Subcategories
This category has the following 15 subcategories, out of 15 total.
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J
M
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Pages in category "G02B6/43"
The following 80 pages are in this category, out of 80 total.
1
- 17567497. PHOTONIC SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 17956750. NANOROD COATING BETWEEN TWO OPTICAL MEDIUMS simplified abstract (Intel Corporation)
- 17958002. MICROELECTRONICS PACKAGES WITH PHOTO-INTEGRATED GLASS INTERPOSER simplified abstract (Intel Corporation)
- 18059074. PHOTONIC INTEGRATED CIRCUIT PACKAGES INCLUDING SUBSTRATES WITH GLASS CORES simplified abstract (Intel Corporation)
- 18473711. SELECTIVE TRANSFER OF OPTICAL AND OPTO-ELECTRONIC COMPONENTS (Intel Corporation)
- 18562593. OPTICAL WIRING COMPONENT, OPTICAL DEVICE, AND METHOD OF ASSEMBLING OPTICAL DEVICE simplified abstract (SUMITOMO ELECTRIC INDUSTRIES, LTD.)
- 18580337. OPTICAL FIBER MODULE simplified abstract (SUMITOMO ELECTRIC INDUSTRIES, LTD.)
- 18586919. Photonic Semiconductor Device and Method of Manufacture simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18587406. MULTI-WAFER INTEGRATION simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18603283. NANOPARTICLE FLUOROPOLYMER ELECTRODE simplified abstract (KING FAHD UNIVERSITY OF PETROLEUM AND MINERALS)
- 18656367. 3D System and Wafer Reconstitution with Mid-layer Interposer based on µbump (Apple Inc.)
- 18664224. OPTOELECTRONIC PACKAGE AND METHOD OF MANUFACTURING THE SAME simplified abstract (Advanced Semiconductor Engineering, Inc.)
- 18676584. SEMICONDUCTOR PACKAGE (SAMSUNG ELECTRONICS CO., LTD.)
- 18681247. OPTICAL MODULE AND OPTICAL COMMUNICATION DEVICE simplified abstract (KYOCERA CORPORATION)
- 18746934. PACKAGE STRUCTURE INCLUDING PHOTONIC PACKAGE AND INTERPOSER HAVING WAVEGUIDE simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18748090. OPTICAL SENSOR AND ELECTRONIC DEVICE COMPRISING SAME (SAMSUNG ELECTRONICS CO., LTD.)
- 18757571. SYSTEM, APPARATUS, AND METHOD OF LINK TRAINING OVER A REDRIVER-BASED OPTICAL INTERCONNECT simplified abstract (Intel Corporation)
- 18773021. SEMICONDUCTOR PACKAGE INCLUDING PHOTONIC CHIP (Samsung Electronics Co., Ltd.)
- 18775260. SEMICONDUCTOR PACKAGE (Samsung Electronics Co., Ltd.)
- 18795148. INTEGRATED CIRCUIT PACKAGE WITH ELECTRO-OPTICAL INTERCONNECT CIRCUITRY (Intel Corporation)
- 18928505. Optical Packages with LED Interconnects (Google LLC)
- 18981135. APPARATUS AND METHODS FOR OPTICAL INTERCONNECTS (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18985362. Photonic Semiconductor Device and Method of Manufacture (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 19000354. PHOTONICS PACKAGE INTEGRATION (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
2
A
- Apple inc. (20240102856). Despeckling in Optical Measurement Systems simplified abstract
- Apple inc. (20240105704). 3D Package with Chip-on-Reconstituted Wafer or Reconstituted Wafer-on-Reconstituted Wafer Bonding simplified abstract
- Apple inc. (20250112192). 3D System and Wafer Reconstitution with Mid-layer Interposer based on µbump
- Apple Inc. patent applications on April 3rd, 2025
- Apple Inc. patent applications on February 13th, 2025
- Apple Inc. patent applications on March 28th, 2024
B
G
H
I
- Intel corporation (20240111089). NANOROD COATING BETWEEN TWO OPTICAL MEDIUMS simplified abstract
- Intel corporation (20240112972). MICROELECTRONICS PACKAGES WITH PHOTO-INTEGRATED GLASS INTERPOSER simplified abstract
- Intel corporation (20240176085). PHOTONIC INTEGRATED CIRCUIT PACKAGES INCLUDING SUBSTRATES WITH GLASS CORES simplified abstract
- Intel corporation (20240264396). CO-PACKAGING WITH SILICON PHOTONICS HYBRID PLANAR LIGHTWAVE CIRCUIT simplified abstract
- Intel corporation (20240345345). SYSTEM, APPARATUS, AND METHOD OF LINK TRAINING OVER A REDRIVER-BASED OPTICAL INTERCONNECT simplified abstract
- Intel corporation (20240418951). INTEGRATED CIRCUIT PACKAGE WITH ELECTRO-OPTICAL INTERCONNECT CIRCUITRY
- Intel corporation (20250105053). SELECTIVE TRANSFER OF OPTICAL AND OPTO-ELECTRONIC COMPONENTS
- Intel Corporation patent applications on April 4th, 2024
- Intel Corporation patent applications on August 8th, 2024
- Intel Corporation patent applications on December 19th, 2024
- Intel Corporation patent applications on February 6th, 2025
- Intel Corporation patent applications on January 25th, 2024
- Intel Corporation patent applications on March 27th, 2025
- Intel Corporation patent applications on May 30th, 2024
- Intel Corporation patent applications on October 17th, 2024
N
S
- Samsung electronics co., ltd. (20240418934). OPTICAL SENSOR AND ELECTRONIC DEVICE COMPRISING SAME
- Samsung electronics co., ltd. (20250102748). SEMICONDUCTOR PACKAGE
- Samsung electronics co., ltd. (20250125312). SEMICONDUCTOR PACKAGE INCLUDING PHOTONIC CHIP
- Samsung electronics co., ltd. (20250125321). SEMICONDUCTOR PACKAGE
- Samsung Electronics Co., Ltd. patent applications on April 17th, 2025
- Samsung Electronics Co., Ltd. patent applications on December 19th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on December 19th, 2024
- Samsung Electronics Co., Ltd. patent applications on March 27th, 2025
- SAMSUNG ELECTRONICS CO., LTD. patent applications on March 27th, 2025
T
- Taiwan semiconductor manufacturing co., ltd. (20240192456). Photonic Semiconductor Device and Method of Manufacture simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240194650). MULTI-WAFER INTEGRATION simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20250110303). APPARATUS AND METHODS FOR OPTICAL INTERCONNECTS
- Taiwan semiconductor manufacturing co., ltd. (20250123458). Photonic Semiconductor Device and Method of Manufacture
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on April 17th, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on April 3rd, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on June 13th, 2024
- Taiwan semiconductor manufacturing company, ltd. (20240337800). PACKAGE STRUCTURE INCLUDING PHOTONIC PACKAGE AND INTERPOSER HAVING WAVEGUIDE simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20250062300). SEMICONDUCTOR PACKAGE STRUCTURE COMPRISING PHOTONIC IC CHIP ADJACENT TO ELECTRICAL IC CHIP
- Taiwan semiconductor manufacturing company, ltd. (20250130384). PHOTONICS PACKAGE INTEGRATION
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. patent applications on April 24th, 2025
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. patent applications on February 20th, 2025
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. patent applications on October 10th, 2024