OPTICAL MODULE AND OPTICAL COMMUNICATION DEVICE

Organization Name

Inventor(s)

Tomoyuki Akahoshi of Nara-shi, Nara (JP)

Takashi Yamamoto of Kyotanabe-shi, Kyoto (JP)

OPTICAL MODULE AND OPTICAL COMMUNICATION DEVICE - A simplified explanation of the abstract

This abstract first appeared for US patent application 18681247 titled 'OPTICAL MODULE AND OPTICAL COMMUNICATION DEVICE

The patent application describes a module substrate with multiple optical ICs mounted on it, each performing photoelectric conversion at different positions in the y direction.

Multiple optical ICs are mounted on a module substrate at different positions in the y direction.
Fiber bundles extend from the optical ICs towards a first side in the x direction.
Optical connectors at the ends of the fiber bundles connect to external optical elements.
Control ICs are mounted on the substrate to control the optical ICs.
Power supply ICs are mounted on the substrate to supply power to the optical ICs.

Potential Applications: - Optical communication systems - Data transmission networks - Medical imaging devices

Problems Solved: - Efficient photoelectric conversion - Simplified optical signal transmission - Improved control and power supply for optical ICs

Benefits: - Enhanced performance of optical systems - Streamlined data transmission processes - Increased reliability and stability

Commercial Applications: Title: Optical Communication Module for Enhanced Data Transmission This technology can be used in telecommunications, data centers, and medical imaging equipment, improving the efficiency and reliability of optical systems.

Questions about the technology: 1. How does the placement of multiple optical ICs on the module substrate improve performance? 2. What are the advantages of using fiber bundles for optical signal transmission?

Original Abstract Submitted

Multiple optical ICs () are mounted on a first mounting surface () of a module substrate () at different positions in a first direction (y direction) from each other and are configured to perform photoelectric conversion. Multiple fiber bundles () each include multiple optical fibers () extending in parallel with each other and extend out from the multiple optical ICs toward a first side in a second direction (x direction). Multiple optical connectors () are located at opposite ends of the multiple fiber bundles from the multiple optical ICs, are connected to external optical elements, and allow transmission of optical signals. At least one control IC () is mounted on the module substrate and is configured to control at least one of the multiple optical ICs. At least one power supply IC () is mounted on the module substrate and is configured to supply power to at least one of the multiple optical ICs.