Intel corporation (20240418951). INTEGRATED CIRCUIT PACKAGE WITH ELECTRO-OPTICAL INTERCONNECT CIRCUITRY
INTEGRATED CIRCUIT PACKAGE WITH ELECTRO-OPTICAL INTERCONNECT CIRCUITRY
Organization Name
Inventor(s)
Joel Martinez of Hayward CA (US)
Jon Long of Scotts Valley CA (US)
INTEGRATED CIRCUIT PACKAGE WITH ELECTRO-OPTICAL INTERCONNECT CIRCUITRY
This abstract first appeared for US patent application 20240418951 titled 'INTEGRATED CIRCUIT PACKAGE WITH ELECTRO-OPTICAL INTERCONNECT CIRCUITRY
Original Abstract Submitted
a multichip package may include at least a package substrate, a main die mounted on the package substrate, a transceiver die mounted on the package substrate, and an optical engine die mounted on the package substrate. the main die may communicate with the transceiver die via a first high-bandwidth interconnect bridge embedded in the package substrate. the transceiver die may communicate with the optical engine die via a second high-bandwidth interconnect bridge embedded in the package substrate. the transceiver die has physical-layer circuits that directly drive the optical engine. an optical cable can be connected directly to the optical engine of the multichip package.