18773021. SEMICONDUCTOR PACKAGE INCLUDING PHOTONIC CHIP (Samsung Electronics Co., Ltd.)

SEMICONDUCTOR PACKAGE INCLUDING PHOTONIC CHIP

Organization Name

Samsung Electronics Co., Ltd.

Inventor(s)

Junghoon Kang of Suwon-si KR

Daegon Kim of Suwon-si KR

SEMICONDUCTOR PACKAGE INCLUDING PHOTONIC CHIP

This abstract first appeared for US patent application 18773021 titled 'SEMICONDUCTOR PACKAGE INCLUDING PHOTONIC CHIP

Original Abstract Submitted

A semiconductor package includes a package substrate, an electronic integrated circuit chip mounted on the package substrate, a first photonic integrated circuit chip mounted on the electronic integrated circuit chip, the first photonic integrated circuit chip including a first groove recessed from a top surface and a side surface of the first photonic integrated circuit chip, and a second photonic integrated circuit chip mounted on the first photonic integrated circuit chip, the second photonic integrated circuit chip including a second groove recessed from a top surface and a side surface of the second photonic integrated circuit chip, wherein the second photonic integrated circuit chip is offset-stacked on the first photonic integrated circuit chip, wherein at least a portion of a bottom surface of the first groove of the first photonic integrated circuit chip is exposed to the outside.