APPARATUS AND METHODS FOR OPTICAL INTERCONNECTS

Organization Name

Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor(s)

Stefan Rusu of Sunnyvale CA US

Wei-wei Song of Sunnyvale CA US

Mohammed Rabiul Islam of Austin TX US

Chih-Tsung Shih of Hsinchu City TW

APPARATUS AND METHODS FOR OPTICAL INTERCONNECTS

This abstract first appeared for US patent application 18981135 titled 'APPARATUS AND METHODS FOR OPTICAL INTERCONNECTS

Original Abstract Submitted

Disclosed are apparatus and methods for optical interconnections that include the integration of a photonics die (pDie) and an electronic die (eDie) with a socket layer, waveguides and fiber connectors to enable high bandwidth communications. In one embodiment, an exemplary optical interconnect device includes an electronic die coupled to a photonics die and integrated with a substrate, a socket, a board, a pair of micro-lenses and a mirror coupled to a waveguide, which can be embedded in the board. In another embodiment, the waveguide is embedded in a socket layer and coupled to a fiber connector. In these embodiments, the exemplary optical interface device can be coupled one more other optical interconnect devices via a waveguide array and/or a fiber array.