19000354. PHOTONICS PACKAGE INTEGRATION (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
PHOTONICS PACKAGE INTEGRATION
Organization Name
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Inventor(s)
Stefan Rusu of Sunnyvale CA US
PHOTONICS PACKAGE INTEGRATION
This abstract first appeared for US patent application 19000354 titled 'PHOTONICS PACKAGE INTEGRATION
Original Abstract Submitted
An interconnect package integrates a photonic die, an electronic die, and a switch ASIC into one package. At least some of the components in the electronic die, such as, for example, the serializer/deserializer circuits, transceivers, clocking circuitry, and/or control circuitry are integrated into the switch ASIC to produce an integrated switch ASIC. The photonic die is attached and electrically connected to the integrated switch ASIC.