MULTI-WAFER INTEGRATION

Organization Name

Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor(s)

Chin-Min Lin of Hsinchu City (TW)

Hung-Jen Hsu of Taoyuan (TW)

Dun-Nian Yaung of Taipei City (TW)

MULTI-WAFER INTEGRATION - A simplified explanation of the abstract

This abstract first appeared for US patent application 18587406 titled 'MULTI-WAFER INTEGRATION

Simplified Explanation

The patent application describes a method of forming semiconductor devices by bonding wafers containing electronic integrated circuits (EICs) and photonic integrated circuits (PICs) to create a stacked wafer with vertically aligned EICs and PICs.

The method involves forming a first wafer with EICs and a second wafer with PICs.
These wafers are then bonded together to create a stacked wafer with aligned EICs and PICs.

Key Features and Innovation

Integration of electronic and photonic components in a single stacked wafer.
Vertical alignment of EICs with PICs for improved performance.
Efficient manufacturing process for semiconductor devices.

Potential Applications

The technology can be used in:

Telecommunications for high-speed data transmission.
Data centers for improved processing capabilities.
Medical devices for enhanced imaging and diagnostics.

Problems Solved

Integration of electronic and photonic components.
Alignment of EICs and PICs for optimal performance.
Streamlining manufacturing processes for semiconductor devices.

Benefits

Enhanced performance of semiconductor devices.
Improved data transmission speeds.
Simplified manufacturing processes.

Commercial Applications

Telecommunications industry for high-speed data transmission.
Data centers for improved processing capabilities.
Medical device manufacturers for enhanced imaging and diagnostics.

Prior Art

Prior research in the field of semiconductor device integration and alignment techniques.

Frequently Updated Research

Ongoing research in semiconductor device manufacturing processes and integration techniques.

Questions about Semiconductor Device Integration

How does the vertical alignment of EICs with PICs improve performance?

Vertical alignment ensures optimal connection between electronic and photonic components, enhancing overall device efficiency.

What are the potential challenges in bonding wafers with different types of integrated circuits?

Challenges may include ensuring precise alignment, preventing damage during bonding, and maintaining the integrity of the integrated circuits.

Original Abstract Submitted

Semiconductor devices and methods of forming the same are provided. A method according to the present disclosure includes forming a first wafer including a plurality of electronic integrated circuits (EICs), forming a second wafer including a plurality of photonic integrated circuits (PICs), bonding the first wafer to the second wafer to form a first stacked wafer. The bonding of the first wafer to the second wafer includes vertically aligning each of the plurality of the EICs with one of the plurality of the PICs.