Apple inc. (20250112192). 3D System and Wafer Reconstitution with Mid-layer Interposer based on µbump
3D System and Wafer Reconstitution with Mid-layer Interposer based on µbump
Organization Name
Inventor(s)
Sanjay Dabral of Cupertino CA US
SivaChandra Jangam of Milpitas CA US
Kunzhong Hu of Cupertino CA US
3D System and Wafer Reconstitution with Mid-layer Interposer based on µbump
This abstract first appeared for US patent application 20250112192 titled '3D System and Wafer Reconstitution with Mid-layer Interposer based on µbump
Original Abstract Submitted
a system in package structure and method of fabrication using wafer reconstitution are described. in an embodiment a 3d system includes a mid-layer interposer a first package level underneath the mid-layer interposer and a second package level over the mid-layer interposer. first-level dies and second-level dies can be bonded to the mid-layer interposer with ultra fine micro bumps. dies within the first and/or second package levels may optionally be connected with one or more optical interconnect paths.