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Category:CPC H01L24/20
Pages in category "CPC H01L24/20"
The following 112 pages are in this category, out of 112 total.
1
- 18119270. PACKAGE STRUCTURE simplified abstract (Advanced Semiconductor Engineering, Inc.)
- 18187180. PROCESSOR PACKAGE SUBSTRATE WITH HIGH-SPEED TOP-SURFACE CONNECTION TO CABLE INTERCONNECT simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 18484403. PACKAGE COMPONENT AND FORMING METHOD THEREOF (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.)
- 18489886. SEMICONDUCTOR PACKAGE INCLUDING REDISTRIBUTION STRUCTURE AND METHOD OF MANUFACTURING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18500133. SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18584488. SEMICONDUCTOR DEVICES INCLUDING SEED STRUCTURE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR DEVICES simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18599469. CHIP PACKAGE STRUCTURE, PRODUCTION METHOD FOR CHIP PACKAGE STRUCTURE, AND ELECTRONIC DEVICE simplified abstract (Huawei Technologies Co., Ltd.)
- 18618133. SEMICONDUCTOR PACKAGE INCLUDING POST simplified abstract (Samsung Electronics Co., Ltd.)
- 18665806. Semiconductor Package and Method simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18754738. SEMICONDUCTOR PACKAGE (SAMSUNG ELECTRONICS CO., LTD.)
- 18823149. SEMICONDUCTOR DEVICE, WIRELESS COMMUNICATION DEVICE, AND METHOD FOR FABRICATING SEMICONDUCTOR DEVICE (Fujitsu Limited)
- 18891191. WIRING STRUCTURE, SEMICONDUCTOR PACKAGE COMPRISING THE SAME, AND METHOD OF MANUFACTURING THE SAME (SAMSUNG ELECTRONICS CO., LTD.)
- 18898033. SEMICONDUCTOR PACKAGE WITH REDISTRIBUTION STRUCTURE (SAMSUNG ELECTRONICS CO., LTD.)
- 18955905. METHOD OF FABRICATING PACKAGE STRUCTURE HAVING HOLLOW CYLINDERS (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18969410. SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME (SAMSUNG ELECTRONICS CO., LTD.)
- 18999120. SUBMODULE SEMICONDUCTOR PACKAGE (SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC)
2
- 20250167154. Advanced High Frequency (Rockwell Collins, .)
- 20250167155. Semiconductor Pa (Samsung Electronics ., .)
- 20250167156. Semiconductor Pa (Samsung Electronics ., .)
- 20250174592. Electronic Device Meth (InnoLux)
- 20250183213. Semiconductor Structure Forming Method Ther (Taiwan Semiconductor Manufacturing , .)
- 20250219002. Electrolytic Indium-palladiu (Intel)
- 20250219003. Redistribution Layer Str (SILICON BOX .)
- 20250233096. Wiring Structure (SAMSUNG ELECTRONICS ., .)
A
- Adeia Semiconductor Bonding Technologies Inc. Patent Application Trends in 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC. Patent Application Trends in 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC. Patent Application Trends in 2025
- Advanced Semiconductor Engineering, Inc. Patent Application Trends in 2025
- Amkor Technology Singapore Holding Pte. Ltd. Patent Application Trends in 2025
- Apple Inc Patent Application Trends in 2025
- Apple Inc. Patent Application Trends in 2025
F
H
I
- Innolux Corporation Patent Application Trends in 2024
- INTEL CORPORATION Patent Application Trends in 2025
- Intel Corporation Patent Application Trends in 2025
- International business machines corporation (20240321802). PROCESSOR PACKAGE SUBSTRATE WITH HIGH-SPEED TOP-SURFACE CONNECTION TO CABLE INTERCONNECT simplified abstract
- International business machines corporation (20240332239). HYBRID BOND INTEGRATION FOR MULTI-DIE ASSEMBLY simplified abstract
- International Business Machines Corporation patent applications on October 3rd, 2024
- INTERNATIONAL BUSINESS MACHINES CORPORATION patent applications on September 26th, 2024
M
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Q
R
S
- SAMSUNG ELECTRONICS CO., LTD Patent Application Trends in 2024
- Samsung electronics co., ltd. (20240194627). SEMICONDUCTOR DEVICES INCLUDING SEED STRUCTURE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR DEVICES simplified abstract
- Samsung electronics co., ltd. (20240243090). SEMICONDUCTOR PACKAGE INCLUDING POST simplified abstract
- Samsung electronics co., ltd. (20240321804). SEMICONDUCTOR PACKAGE INCLUDING REDISTRIBUTION STRUCTURE AND METHOD OF MANUFACTURING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240429192). SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Samsung electronics co., ltd. (20250062266). SEMICONDUCTOR PACKAGE
- Samsung electronics co., ltd. (20250079382). SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE
- Samsung electronics co., ltd. (20250096179). SEMICONDUCTOR PACKAGE
- Samsung electronics co., ltd. (20250096181). SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
- Samsung electronics co., ltd. (20250140727). WIRING STRUCTURE, SEMICONDUCTOR PACKAGE COMPRISING THE SAME, AND METHOD OF MANUFACTURING THE SAME
- Samsung electronics co., ltd. (20250140728). SEMICONDUCTOR PACKAGE WITH REDISTRIBUTION STRUCTURE
- Samsung Electronics Co., Ltd. Patent Application Trends in 2024
- SAMSUNG ELECTRONICS CO., LTD. Patent Application Trends in 2024
- Samsung electronics Co., Ltd. Patent Application Trends in 2024
- Samsung electronics CO., LTD. Patent Application Trends in 2025
- SAMSUNG ELECTRONICS CO., LTD. Patent Application Trends in 2025
- Samsung Electronics Co., Ltd. patent applications on December 26th, 2024
- Samsung Electronics Co., Ltd. patent applications on February 20th, 2025
- SAMSUNG ELECTRONICS CO., LTD. patent applications on February 20th, 2025
- Samsung Electronics Co., Ltd. patent applications on July 18th, 2024
- Samsung Electronics Co., Ltd. patent applications on June 13th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on June 13th, 2024
- Samsung Electronics Co., Ltd. patent applications on March 20th, 2025
- SAMSUNG ELECTRONICS CO., LTD. patent applications on March 20th, 2025
- Samsung Electronics Co., Ltd. patent applications on March 6th, 2025
- Samsung Electronics Co., Ltd. patent applications on May 1st, 2025
- SAMSUNG ELECTRONICS CO., LTD. patent applications on May 1st, 2025
- Samsung Electronics Co., Ltd. patent applications on September 26th, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC Patent Application Trends in 2024
- SILICONWARE PRECISION INDUSTRIES CO., LTD. Patent Application Trends in 2024
- SiPLP Microelectronics (Chongqing) Limited Patent Application Trends in 2024
- SiPLP Microelectronics (Chongqing) Limited Patent Application Trends in 2025
- SK hynix Inc. Patent Application Trends in 2025
T
- Taiwan Semiconductor Manufacturing Co., Ltd Patent Application Trends in 2024
- Taiwan semiconductor manufacturing co., ltd. (20250087615). METHOD OF FABRICATING PACKAGE STRUCTURE HAVING HOLLOW CYLINDERS
- Taiwan Semiconductor Manufacturing Co., Ltd. Patent Application Trends in 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. Patent Application Trends in 2025
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on March 13th, 2025
- Taiwan Semiconductor Manufacturing Company Limited Patent Application Trends in 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. Patent Application Trends in 2025
- Taiwan Semiconductor Manufacturing Company Patent Application Trends in 2025
- Taiwan semiconductor manufacturing company, ltd. (20240304585). Semiconductor Package and Method simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240379606). METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20250149491). SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME
- Taiwan Semiconductor Manufacturing Company, Ltd. Patent Application Trends in 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. Patent Application Trends in 2025
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. Patent Application Trends in 2025
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on May 8th, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on November 14th, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on September 12th, 2024
- Taiwan Semiconductor Manufacturning Company, Ltd. Patent Application Trends in 2025
- TDK Corporation Patent Application Trends in 2024