Samsung electronics co., ltd. (20250062266). SEMICONDUCTOR PACKAGE
SEMICONDUCTOR PACKAGE
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SEMICONDUCTOR PACKAGE
This abstract first appeared for US patent application 20250062266 titled 'SEMICONDUCTOR PACKAGE
Original Abstract Submitted
a semiconductor package includes a redistribution substrate including a first surface and a second surface which are opposite to each other, a semiconductor chip on the first surface of the redistribution substrate, and a connection terminal on the second surface of the redistribution substrate. the redistribution substrate includes an insulating layer, a redistribution pattern in the insulating layer, and an under bump pattern between the redistribution pattern and the connection terminal. the under bump pattern includes a via portion penetrating the insulating layer and connected to the redistribution pattern, and a protrusion protruding into the insulating layer.