Electronic device and method for manufacturing the same

Abstract: an electronic device and a manufacturing method thereof are provided. the electronic device includes: an electronic unit including a semiconductor structure and a first crack stopper layer disposed on a first side of the semiconductor structure; a second crack stopper layer disposed on a second side of the semiconductor structure, wherein the first side is opposite to the second side; and a first insulating layer surrounding the electronic unit, wherein a young's modulus of the first crack stopper layer is less than a young's modulus of the second crack stopper layer.

Inventor(s): Ker-Yih KAO

CPC Classification: H01L24/20 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (use of semiconductor devices for measuring ; resistors in general ; magnets, inductors or transformers ; capacitors in general ; electrolytic devices ; batteries or accumulators ; waveguides, resonators or lines of the waveguide type ; line connectors or current collectors ; stimulated-emission devices ; electromechanical resonators ; loudspeakers, microphones, gramophone pick-ups or like acoustic electromechanical transducers ; electric light sources in general ; printed circuits, hybrid circuits, casings or constructional details of electrical apparatus, manufacture of assemblages of electrical components ; use of semiconductor devices in circuits having a particular application, see the subclass for the application))

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