WIRING STRUCTURE, SEMICONDUCTOR PACKAGE INCLUDING THE WIRING STRUCTURE AND METHOD OF MANUFACTURING THE WIRING STRUCTURE

Abstract: a wiring structure includes: a plurality of wiring layers and a plurality of insulating layers. the plurality of wiring layers include a first wiring layer that include a wiring pattern and a cavity, and the plurality of insulating layers include a first insulating layer that fills the cavity, and a second insulating layer that contacts each of the first wiring layer and the first insulating layer and covers the first wiring layer and the first insulating layer.

Inventor(s): SOYEON MOON, SEUNG HUN CHAE, UN-BYOUNG KANG

CPC Classification: H01L24/20 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (use of semiconductor devices for measuring ; resistors in general ; magnets, inductors or transformers ; capacitors in general ; electrolytic devices ; batteries or accumulators ; waveguides, resonators or lines of the waveguide type ; line connectors or current collectors ; stimulated-emission devices ; electromechanical resonators ; loudspeakers, microphones, gramophone pick-ups or like acoustic electromechanical transducers ; electric light sources in general ; printed circuits, hybrid circuits, casings or constructional details of electrical apparatus, manufacture of assemblages of electrical components ; use of semiconductor devices in circuits having a particular application, see the subclass for the application))

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