REDISTRIBUTION LAYER STRUCTURE, METHOD OF FORMING REDISTRIBUTION LAYER STRUCTURE, SEMICONDUCTOR PACKAGE DEVICE INCLUDING REDISTRIBUTION LAYER STRUCTURE, AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE DEVICE INCLUDING REDISTRIBUTION LAYER STRUCTURE

Abstract: disclosed are a redistribution layer structure, a method of forming a redistribution layer structure, a semiconductor package device including a redistribution layer structure, and a method of manufacturing a semiconductor package device including a redistribution layer structure. the semiconductor package device may include a redistribution layer structure, wherein the redistribution layer structure may include a first insulating layer having one or more openings open to a target region and an unetched portion configured to improve the flatness of the redistribution layer structure in the remaining region excluding the one or more openings in the space corresponding to the target region and a first wiring member layer disposed on the first insulating layer so as to at least partially fill the one or more openings.

Inventor(s): Byung Joon HAN, Young Michael HAN, Byung Hoon AHN

CPC Classification: H01L24/20 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (use of semiconductor devices for measuring ; resistors in general ; magnets, inductors or transformers ; capacitors in general ; electrolytic devices ; batteries or accumulators ; waveguides, resonators or lines of the waveguide type ; line connectors or current collectors ; stimulated-emission devices ; electromechanical resonators ; loudspeakers, microphones, gramophone pick-ups or like acoustic electromechanical transducers ; electric light sources in general ; printed circuits, hybrid circuits, casings or constructional details of electrical apparatus, manufacture of assemblages of electrical components ; use of semiconductor devices in circuits having a particular application, see the subclass for the application))

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