ELECTROLYTIC INDIUM-PALLADIUM-GOLD AS A SURFACE FINISH FOR EMBEDDED DIE ATTACHMENTS

Abstract: in embodiments herein, a surface finish (sf) is formed on conductive contacts of a package substrate for connection to an embedded interconnect bridge circuitry die. in some embodiments, the sf may be electroless nickel-electroless palladium-immersion gold (enepig). in other embodiments, the sf may be immersion gold-electroless palladium-immersion gold (igepig). in other embodiments, the sf may include a layer of electrolytic palladium-gold on a layer of indium or on a layer of cobalt-iron.

Inventor(s): Shruti Sharma, Prithwish Chatterjee, Numair Ahmed, Yuxin Fang, Siddharth Alur Narasimha Krishna, Wei-Lun Jen, Mollie A. Stewart, Ali Lehaf, Steve S. Cho, Sang Ha Yoo, David A. Woodley, Srinivas Venkata Ramanuja Pietambaram

CPC Classification: H01L24/20 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (use of semiconductor devices for measuring ; resistors in general ; magnets, inductors or transformers ; capacitors in general ; electrolytic devices ; batteries or accumulators ; waveguides, resonators or lines of the waveguide type ; line connectors or current collectors ; stimulated-emission devices ; electromechanical resonators ; loudspeakers, microphones, gramophone pick-ups or like acoustic electromechanical transducers ; electric light sources in general ; printed circuits, hybrid circuits, casings or constructional details of electrical apparatus, manufacture of assemblages of electrical components ; use of semiconductor devices in circuits having a particular application, see the subclass for the application))

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