SEMICONDUCTOR PACKAGE WITH REDISTRIBUTION STRUCTURE

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SEMICONDUCTOR PACKAGE WITH REDISTRIBUTION STRUCTURE

This abstract first appeared for US patent application 18898033 titled 'SEMICONDUCTOR PACKAGE WITH REDISTRIBUTION STRUCTURE

Original Abstract Submitted

An example semiconductor package includes a redistribution structure, including a first surface and a second surface, and a semiconductor chip on the first surface of the redistribution structure. The redistribution structure includes a plurality of first conductive lines, including a first signal line, and a plurality of second conductive lines at a vertical level different from the plurality of first conductive lines. The plurality of second conductive lines include a ground line electrically insulated from the first signal line. The ground line includes an opening extending through the ground line at a position vertically overlapping the first signal line and a venting hole communicating with a first end portion of the opening. The first end portion of the opening has a first width in a first horizontal direction. The venting hole has a second width smaller than the first width in the first horizontal direction.