18484403. PACKAGE COMPONENT AND FORMING METHOD THEREOF (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.)
PACKAGE COMPONENT AND FORMING METHOD THEREOF
Organization Name
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
Inventor(s)
MING-WEI Peng of TAOYUAN CITY TW
KUO-CHING Hsu of NEW TAIPEI CITY TW
PACKAGE COMPONENT AND FORMING METHOD THEREOF
This abstract first appeared for US patent application 18484403 titled 'PACKAGE COMPONENT AND FORMING METHOD THEREOF
Original Abstract Submitted
A package component includes an insulating substrate, a semiconductor structure, a first conductive line and a conductive pad. The semiconductor structure is disposed in the insulating substrate and separated from the insulating substrate. The first conductive line is disposed on a first side of the insulating substrate. The conductive pad is disposed on a first side of the semiconductor structure. The first conductive line and the conductive pad include a same material. A surface roughness of the conductive pad is greater than a surface roughness of the first conductive line.