Category:Srinivas Venkata Ramanuja Pietambaram of Chandler AZ US
Srinivas Venkata Ramanuja Pietambaram
Srinivas Venkata Ramanuja Pietambaram from Chandler AZ US has applied for patents in technology areas such as H01L23/15, H01L23/24, H01L23/367 with intel corporation.
Patents
Pages in category "Srinivas Venkata Ramanuja Pietambaram of Chandler AZ US"
The following 54 pages are in this category, out of 54 total.
1
- 18372585. NANOTWIN LINER FOR THROUGH GLASS VIAS (Intel Corporation)
- 18373088. ELECTROLESS SEED LAYER DEPOSITION ON GLASS CORE SUBSTRATES (Intel Corporation)
- 18373095. POROUS COPPER LINER FOR THROUGH GLASS VIA (TGV) GLASS CORES (Intel Corporation)
- 18373457. STIFFENER ARCHITECTURES FOR GLASS EDGE PROTECTION (Intel Corporation)
- 18374609. STRESS MITIGATION ARCHITECTURES FOR GLASS CORE SUBSTRATES (INTEL CORPORATION)
- 18374617. THROUGH GLASS VIA (TGV) WITH MODULATED PROFILE FOR CORE STRESS REDUCTION (INTEL CORPORATION)
- 18374932. CONTROLLING SUBSTRATE BUMP HEIGHT (INTEL CORPORATION)
- 18374937. GLASS CORE PROTECTION USING PERIPHERAL BUFFER LAYERS (INTEL CORPORATION)
- 18977572. GLASS CORES INCLUDING PROTRUDING THROUGH GLASS VIAS AND RELATED METHODS (Intel Corporation)
- 18984426. PACKAGE SUBSTRATES WITH COMPONENTS INCLUDED IN CAVITIES OF GLASS CORES (Intel Corporation)
- 18984438. PACKAGE SUBSTRATES WITH COMPONENTS INCLUDED IN CAVITIES OF GLASS CORES (Intel Corporation)
- 18984444. PACKAGE SUBSTRATES WITH COMPONENTS INCLUDED IN CAVITIES OF GLASS CORES (Intel Corporation)
- 18984454. PACKAGE SUBSTRATES WITH COMPONENTS INCLUDED IN CAVITIES OF GLASS CORES (Intel Corporation)
2
- 20250183182. Microelectronic Assemblie (Unknown Organization)
- 20250218880. Microelectronic Assemblies W (Intel)
- 20250218904. Technologies Power S (Intel)
- 20250218910. Immersion Gold-electroless P (Intel)
- 20250218911. Electrolytic Cobalt-iron-pal (Intel)
- 20250218924. Electroless Nickel-electrole (Intel)
- 20250218925. Electroless Nickel-electrole (Intel)
- 20250218926. Microelectronic Assemblies I (Intel)
- 20250218958. Pedestals Semiconductor (Intel)
- 20250218960. Methods Apparatus Emb (Intel)
- 20250218961. Methods Apparatus Fac (Intel)
- 20250218962. Technologies Stack (Intel)
- 20250218964. Technologies Connected C (Intel)
- 20250218982. Technologies Ceramic Com (Intel)
- 20250219002. Electrolytic Indium-palladiu (Intel)
- 20250219021. Vertically Embedded Componen (Intel)
- 20250703 Patent Applications Report for July 3rd, 2025
I
- Intel corporation (20250006569). METHODS AND APPARATUS FOR PACKAGE SUBSTRATES WITH STACKS OF GLASS LAYERS HAVING DIFFERENT COEFFICIENTS OF THERMAL EXPANSION
- Intel corporation (20250006570). GLASS CORES INCLUDING MULTIPLE LAYERS AND RELATED METHODS
- Intel corporation (20250006571). METHODS AND APPARATUS FOR STACKS OF GLASS LAYERS INCLUDING THIN FILM CAPACITORS
- Intel corporation (20250006609). METHODS AND APPARATUS FOR PACKAGE SUBSTRATES WITH STACKS OF GLASS LAYERS HAVING DIFFERENT COEFFICIENTS OF THERMAL EXPANSION
- Intel corporation (20250006610). METHODS AND APPARATUS FOR POWER DELIVERY THROUGH PACKAGE SUBSTRATES WITH STACKS OF GLASS LAYERS HAVING DIFFERENT COEFFICIENTS OF THERMAL EXPANSION
- Intel corporation (20250006611). METHODS AND APPARATUS FOR POWER DELIVERY THROUGH PACKAGE SUBSTRATES WITH STACKS OF GLASS LAYERS HAVING DIFFERENT COEFFICIENTS OF THERMAL EXPANSION
- Intel corporation (20250006612). METHODS AND APPARATUS FOR POWER DELIVERY THROUGH PACKAGE SUBSTRATES WITH STACKS OF GLASS LAYERS HAVING DIFFERENT COEFFICIENTS OF THERMAL EXPANSION
- Intel corporation (20250006613). METHODS AND APPARATUS FOR PACKAGE SUBSTRATES WITH STACKS OF GLASS LAYERS INCLUDING INTERCONNECT BRIDGES
- Intel corporation (20250006665). METHODS AND APPARATUS FOR STACKS OF GLASS LAYERS INCLUDING DEEP TRENCH CAPACITORS
- Intel corporation (20250006671). SEMICONDUCTOR LAYER WITH DRY DEPOSITION LAYER
- Intel corporation (20250022786). METHODS AND APPARATUS FOR EDGE PROTECTED GLASS CORES
- Intel corporation (20250105074). GLASS CORES INCLUDING PROTRUDING THROUGH GLASS VIAS AND RELATED METHODS
- Intel corporation (20250105132). POROUS COPPER LINER FOR THROUGH GLASS VIA (TGV) GLASS CORES
- Intel corporation (20250106982). NANOTWIN LINER FOR THROUGH GLASS VIAS
- Intel corporation (20250106983). STIFFENER ARCHITECTURES FOR GLASS EDGE PROTECTION
- Intel corporation (20250106997). ELECTROLESS SEED LAYER DEPOSITION ON GLASS CORE SUBSTRATES
- Intel corporation (20250112136). GLASS CORE PROTECTION USING PERIPHERAL BUFFER LAYERS
- Intel corporation (20250112140). STRESS MITIGATION ARCHITECTURES FOR GLASS CORE SUBSTRATES
- Intel corporation (20250112164). CONTROLLING SUBSTRATE BUMP HEIGHT
- Intel corporation (20250113434). THROUGH GLASS VIA (TGV) WITH MODULATED PROFILE FOR CORE STRESS REDUCTION
- Intel corporation (20250120102). PACKAGE SUBSTRATES WITH COMPONENTS INCLUDED IN CAVITIES OF GLASS CORES
- Intel corporation (20250125201). PACKAGE SUBSTRATES WITH COMPONENTS INCLUDED IN CAVITIES OF GLASS CORES
- Intel corporation (20250125202). PACKAGE SUBSTRATES WITH COMPONENTS INCLUDED IN CAVITIES OF GLASS CORES
- Intel corporation (20250126814). PACKAGE SUBSTRATES WITH COMPONENTS INCLUDED IN CAVITIES OF GLASS CORES