20250218924. Electroless Nickel-electrole (Intel)
ELECTROLESS NICKEL-ELECTROLESS PALLADIUM-IMMERSION GOLD (ENEPIG) AS A SURFACE FINISH FOR EMBEDDED DIE ATTACHMENTS
Abstract: in embodiments herein, a surface finish (sf) is formed on conductive contacts of a package substrate for connection to an embedded interconnect bridge circuitry die. in some embodiments, the sf may be electroless nickel-electroless palladium-immersion gold (enepig). in other embodiments, the sf may be immersion gold-electroless palladium-immersion gold (igepig). in other embodiments, the sf may include a layer of electrolytic palladium-gold on a layer of indium or on a layer of cobalt-iron.
Inventor(s): Prithwish Chatterjee, Shruti Sharma, Numair Ahmed, Yuxin Fang, Wei-Lun Jen, Siddharth Alur Narasimha Krishna, Mollie A. Stewart, Srinivas Venkata Ramanuja Pietambaram, Suresh T. Narute
CPC Classification: H01L23/49866 ({characterised by the materials (materials of the substrates , of the lead-frames )})
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- Patent Applications
- Intel Corporation
- CPC H01L23/49866
- Prithwish Chatterjee of Chandler AZ US
- Shruti Sharma of Chandler AZ US
- Numair Ahmed of Chandler AZ US
- Yuxin Fang of Chandler AZ US
- Wei-Lun Jen of Phoenix AZ US
- Siddharth Alur Narasimha Krishna of Gilbert AZ US
- Mollie A. Stewart of Lake Oswego OR US
- Srinivas Venkata Ramanuja Pietambaram of Chandler AZ US
- Suresh T. Narute of Chandler AZ US