Intel corporation (20250106982). NANOTWIN LINER FOR THROUGH GLASS VIAS
NANOTWIN LINER FOR THROUGH GLASS VIAS
Organization Name
Inventor(s)
Sashi S. Kandanur of Phoenix AZ US
Nicholas S. Haehn of Scottsdale AZ US
Srinivas Venkata Ramanuja Pietambaram of Chandler AZ US
Steve S. Cho of Chandler AZ US
NANOTWIN LINER FOR THROUGH GLASS VIAS
This abstract first appeared for US patent application 20250106982 titled 'NANOTWIN LINER FOR THROUGH GLASS VIAS
Original Abstract Submitted
embodiments disclosed herein include glass cores with through glass vias (tgvs). in an embodiment, an apparatus comprises a solid glass layer with an opening through a thickness of the layer, and a via in the opening. in an embodiment, the via comprises a first portion along sidewalls of the opening, where the first portion has a first microstructure, and a second portion in the opening, where the first portion surrounds the second portion, and where the second portion has a second microstructure that is different than the first microstructure.