20250218911. Electrolytic Cobalt-iron-pal (Intel)
ELECTROLYTIC COBALT-IRON-PALLADIUM-GOLD AS A SURFACE FINISH FOR EMBEDDED DIE ATTACHMENTS
Abstract: in embodiments herein, a surface finish (sf) is formed on conductive contacts of a package substrate for connection to an embedded interconnect bridge circuitry die. in some embodiments, the sf may be electroless nickel-electroless palladium-immersion gold (enepig). in other embodiments, the sf may be immersion gold-electroless palladium-immersion gold (igepig). in other embodiments, the sf may include a layer of electrolytic palladium-gold on a layer of indium or on a layer of cobalt-iron.
Inventor(s): Shruti Sharma, Prithwish Chatterjee, Numair Ahmed, Yuxin Fang, Siddharth Alur Narasimha Krishna, Wei-Lun Jen, Mollie A. Stewart, Ali Lehaf, Steve S. Cho, Sang Ha Yoo, David A. Woodley, Srinivas Venkata Ramanuja Pietambaram, Farzaneh Saeedifard
CPC Classification: H01L23/49811 ({Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads ( takes precedence)})
Search for rejections for patent application number 20250218911
- Patent Applications
- Intel Corporation
- CPC H01L23/49811
- Shruti Sharma of Chandler AZ US
- Prithwish Chatterjee of Chandler AZ US
- Numair Ahmed of Chandler AZ US
- Yuxin Fang of Chandler AZ US
- Siddharth Alur Narasimha Krishna of Gilbert AZ US
- Wei-Lun Jen of Phoenix AZ US
- Mollie A. Stewart of Lake Oswego OR US
- Ali Lehaf of Phoenix AZ US
- Steve S. Cho of Chandler AZ US
- Sang Ha Yoo of Gilbert AZ US
- David A. Woodley of Chandler AZ US
- Srinivas Venkata Ramanuja Pietambaram of Chandler AZ US
- Farzaneh Saeedifard of Chandler AZ US