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Category:H05K3/34
Subcategories
This category has the following 47 subcategories, out of 47 total.
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J
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Pages in category "H05K3/34"
The following 103 pages are in this category, out of 103 total.
1
- 17818722. ELECTRIC DEVICE, ITS CIRCUIT BOARD AND METHOD OF MANUFACTURING THE ELECTRIC DEVICE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 17885338. STRESS-RELEASING SOLDER MASK PATTERN FOR SEMICONDUCTOR DEVICES AND RELATED SYSTEMS AND METHODS simplified abstract (Micron Technology, Inc.)
- 17908759. Circuit Board, Electronic Device, and Production Method for Circuit Board simplified abstract (HONOR DEVICE CO., LTD.)
- 17957697. ELECTRONIC DEVICE INCLUDING COIN-CELL BATTERY simplified abstract (Samsung Electronics Co., Ltd.)
- 17969187. REWORKING SOLDER COMPONENT WITHOUT PART REMOVAL simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 18041767. Circuit Board and Manufacturing Method Thereof, and Terminal Device simplified abstract (Honor Device Co., Ltd.)
- 18069004. HYBRID CIRCUIT BOARD DEVICE TO SUPPORT CIRCUIT REUSE AND METHOD OF MANUFACTURE simplified abstract (QUALCOMM Incorporated)
- 18094683. FLEXIBLE PRINTED CIRCUIT AND MANUFACTURING METHOD THEREOF, ELECTRONIC DEVICE MODULE AND ELECTRONIC DEVICE simplified abstract (BOE TECHNOLOGY GROUP CO., LTD.)
- 18110639. REMOVABLE LID FOR FLIP CHIP-BALL GRID ARRAY (FC-BGA) PACKAGES simplified abstract (MELLANOX TECHNOLOGIES, LTD.)
- 18127531. SOLDER REFLOW APPARATUS AND METHOD OF MANUFACTURING AN ELECTRONIC DEVICE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18166473. PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING PACKAGE STRUCTURE simplified abstract (Changxin Memory Technologies, Inc.)
- 18219198. Sulfide Solid-State Battery, Printed Circuit Board with Sulfide Solid-State Battery, and Manufacturing Method of Sulfide Solid-State Battery simplified abstract (TOYOTA JIDOSHA KABUSHIKI KAISHA)
- 18235062. INTERPOSER BOARD AND CIRCUIT BOARD INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
- 18243805. BALL ATTACHMENT APPARATUS simplified abstract (Samsung Electronics Co., Ltd.)
- 18346327. MOUNTING OF CAPACITORS ON PRINTED CIRCUIT BOARDS FOR NON-VOLATILE MEMORY DEVICES simplified abstract (Western Digital Technologies, Inc.)
- 18357379. SOLDER BARRIER CONTACT FOR AN INTEGRATED CIRCUIT simplified abstract (Western Digital Technologies, Inc.)
- 18373776. CIRCUIT BOARD MODULE AND ELECTRONIC DEVICE INCLUDING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18381350. SYSTEM AND METHOD FOR CONTROLLING FLOW OF SOLDER IN A WAVE SOLDERING MACHINE (Illinois Tool Works Inc.)
- 18424194. SYSTEM AND METHOD FOR CONTROLLING FLOW OF SOLDER IN A WAVE SOLDERING MACHINE (Illinois Tool Works Inc.)
- 18432807. ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREFOR simplified abstract (Samsung Electronics Co., Ltd.)
- 18478967. TECHNOLOGIES FOR AN ELECTROMAGNETIC INTERFERENCE SHIELD (INTEL CORPORATION)
- 18502883. PLATED STANDOFF FEATURE FOR PROVIDING STANDOFF BETWEEN CIRCUIT BOARD AND CIRCUIT PACKAGE (Dell Products L.P.)
- 18502914. DIMPLE ON CIRCUIT BOARD FOR PROVIDING STANDOFF BETWEEN CIRCUIT BOARD AND CIRCUIT PACKAGE (Dell Products L.P.)
- 18513045. TECHNOLOGIES FOR REDUCING THE IMPACT OF RADIOFREQUENCY INTERFERENCE ON A CIRCUIT BOARD (INTEL CORPORATION)
- 18550317. ADHESIVE FOR PROVISIONALLY FIXING ELECTRONIC COMPONENT TO SOLDER PRECOAT AND METHOD FOR PRODUCING ELECTRONIC COMPONENT MOUNTED SUBSTRATE simplified abstract (PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.)
- 18576890. SOLDERING SYSTEM AND METHOD OF USE (Illinois Tool Works Inc.)
- 18595697. BOARD AND ELECTRONIC DEVICE (KABUSHIKI KAISHA TOSHIBA)
- 18601190. BALL ATTACH TOOL (Samsung Electronics Co., Ltd.)
- 18607295. CONNECTOR, CONNECTOR PREPARATION METHOD, INTERCONNECTION SYSTEM, AND COMMUNICATION DEVICE simplified abstract (HUAWEI TECHNOLOGIES CO., LTD.)
- 18633698. CONTROL BOARD AND METHOD FOR MANUFACTURING SAME (Hitachi, Ltd.)
- 18634198. Methods And Heat Distribution Devices For Thermal Management Of Chip Assemblies simplified abstract (GOOGLE LLC)
- 18678813. HIGH DENSITY ORGANIC BRIDGE DEVICE AND METHOD simplified abstract (Intel Corporation)
- 18685137. ELECTRONIC ASSEMBLY HAVING A POWER SEMICONDUCTOR COMPONENT BETWEEN TWO CIRCUIT CARRIERS, AND METHOD FOR PRODUCING SAME simplified abstract (Robert Bosch GmbH)
- 18703702. PRINTED CIRCUIT BOARD, MAINTENANCE METHOD THEREFOR, AND DISPLAY APPARATUS (BOE TECHNOLOGY GROUP CO., LTD.)
- 18728619. ANTENNA-INTEGRATED RADIO PRODUCT AND METHOD FOR PRODUCING THE SAME (Telefonaktiebolaget LM Ericsson (publ))
- 18745805. PRINTED CIRCUIT BOARD ASSEMBLY PROCESS USING MULTIPLE SOLDERS AND ASSEMBLED BOARDS MADE USING THE SAME simplified abstract (Dell Products L.P.)
- 18783666. PRINTED CIRCUIT BOARD (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
- 18805678. COMPONENT-ATTACHED FPC MANUFACTURING METHOD (Yazaki Corporation)
- 18892937. SMALL FORM FACTOR SHUNTED SOCKET PINS AND CONFIGURATION FOR IMPROVED SINGLE ENDED SIGNALING (Intel Corporation)
- 18894586. BRIDGE INTERCONNECTION WITH LAYERED INTERCONNECT STRUCTURES (Intel Corporation)
- 18911624. SIGNAL TRACE TRANSITION FOR HIGH DATA RATE APPLICATIONS (Marvell Asia Pte Ltd)
- 19007363. ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME (Advanced Semiconductor Engineering, Inc.)
2
B
D
- Dell products l.p. (20240341040). PRINTED CIRCUIT BOARD ASSEMBLY PROCESS USING MULTIPLE SOLDERS AND ASSEMBLED BOARDS MADE USING THE SAME simplified abstract
- Dell products l.p. (20250151191). DIMPLE ON CIRCUIT BOARD FOR PROVIDING STANDOFF BETWEEN CIRCUIT BOARD AND CIRCUIT PACKAGE
- Dell products l.p. (20250151194). PLATED STANDOFF FEATURE FOR PROVIDING STANDOFF BETWEEN CIRCUIT BOARD AND CIRCUIT PACKAGE
- Dell Products L.P. patent applications on May 8th, 2025
- Dell Products L.P. patent applications on October 10th, 2024
G
H
I
- Intel corporation (20240260193). DECOUPLING CAPACITOR BOOSTER MODULE
- Intel corporation (20240260193). DECOUPLING CAPACITOR BOOSTER MODULE simplified abstract
- Intel corporation (20240321762). HIGH DENSITY ORGANIC BRIDGE DEVICE AND METHOD simplified abstract
- Intel corporation (20250015004). BRIDGE INTERCONNECTION WITH LAYERED INTERCONNECT STRUCTURES
- Intel corporation (20250015527). SMALL FORM FACTOR SHUNTED SOCKET PINS AND CONFIGURATION FOR IMPROVED SINGLE ENDED SIGNALING
- Intel corporation (20250113428). TECHNOLOGIES FOR AN ELECTROMAGNETIC INTERFERENCE SHIELD
- Intel corporation (20250113430). TECHNOLOGIES FOR REDUCING THE IMPACT OF RADIOFREQUENCY INTERFERENCE ON A CIRCUIT BOARD
- Intel Corporation patent applications on April 3rd, 2025
- INTEL CORPORATION patent applications on April 3rd, 2025
- Intel Corporation patent applications on August 1st, 2024
- Intel Corporation patent applications on January 9th, 2025
- Intel Corporation patent applications on September 26th, 2024
- International business machines corporation (20240138074). REWORKING SOLDER COMPONENT WITHOUT PART REMOVAL simplified abstract
- International business machines corporation (20240237228). REWORKING SOLDER COMPONENT WITHOUT PART REMOVAL simplified abstract
- INTERNATIONAL BUSINESS MACHINES CORPORATION patent applications on April 25th, 2024
- INTERNATIONAL BUSINESS MACHINES CORPORATION patent applications on July 11th, 2024
K
P
Q
- Qualcomm incorporated (20240206066). HYBRID CIRCUIT BOARD DEVICE TO SUPPORT CIRCUIT REUSE AND METHOD OF MANUFACTURE simplified abstract
- QUALCOMM Incorporated patent applications on June 20th, 2024
- Quantum Computing patent applications on 28th Feb 2025
- Quantum Computing patent applications on February 27th, 2025
R
S
- Samsung electronics co., ltd. (20240098912). CIRCUIT BOARD MODULE AND ELECTRONIC DEVICE INCLUDING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240179850). ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREFOR simplified abstract
- Samsung electronics co., ltd. (20240207961). BALL ATTACHMENT APPARATUS simplified abstract
- Samsung electronics co., ltd. (20250089179). BALL ATTACH TOOL
- SAMSUNG ELECTRONICS CO., LTD. patent applications on February 8th, 2024
- Samsung Electronics Co., Ltd. patent applications on June 27th, 2024
- Samsung Electronics Co., Ltd. patent applications on March 13th, 2025
- Samsung Electronics Co., Ltd. patent applications on March 21st, 2024
- Samsung Electronics Co., Ltd. patent applications on May 30th, 2024
T
- Telefonaktiebolaget lm ericsson (publ) (20250106999). ANTENNA-INTEGRATED RADIO PRODUCT AND METHOD FOR PRODUCING THE SAME
- Telefonaktiebolaget LM Ericsson (publ) patent applications on March 27th, 2025
- Tesla, Inc. patent applications on February 6th, 2025
- Texas instruments incorporated (20250006510). SEMICONDUCTOR DEVICE PACKAGE WITH WETTABLE FLANKS
- Texas Instruments Incorporated patent applications on January 2nd, 2025
- Toyota jidosha kabushiki kaisha (20240120552). Sulfide Solid-State Battery, Printed Circuit Board with Sulfide Solid-State Battery, and Manufacturing Method of Sulfide Solid-State Battery simplified abstract
- TOYOTA JIDOSHA KABUSHIKI KAISHA patent applications on April 11th, 2024