Western digital technologies, inc. (20240428821). PRE-SOLDER BUMP PREVENTIVE OVERCOATING
PRE-SOLDER BUMP PREVENTIVE OVERCOATING
Organization Name
western digital technologies, inc.
Inventor(s)
Yuhsuke Matsumoto of Fujisawa (JP)
PRE-SOLDER BUMP PREVENTIVE OVERCOATING
This abstract first appeared for US patent application 20240428821 titled 'PRE-SOLDER BUMP PREVENTIVE OVERCOATING
Original Abstract Submitted
a hard disk drive flexure assembly includes an insulative base layer over a metal substrate, a first conductive layer over the base layer, a plurality of electrical pads each comprising a second conductive layer over the first conductive layer, a pre-formed bump of solder material positioned over each pad, and a conductive cover layer over at least a portion of each pre-solder bump. with the conductive cover layer, e.g., gold, solder material from each pre-solder bump is inhibited from transferring to a probe during electrical check of the flexure, the solder material is inhibited from oxidizing, and solder splash is inhibited. these techniques are especially relevant with narrow, high-density, small pitch electrical pads.