Samsung electronics co., ltd. (20240207961). BALL ATTACHMENT APPARATUS simplified abstract

BALL ATTACHMENT APPARATUS

Organization Name

samsung electronics co., ltd.

Inventor(s)

Youngja Kim of Suwon-si (KR)

BALL ATTACHMENT APPARATUS - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240207961 titled 'BALL ATTACHMENT APPARATUS

The patent application describes a ball attachment apparatus used for attaching solder balls to a substrate strip containing multiple substrate units.

• The tool case holds solder balls on its bottom surface for attachment to the substrate strip.
• Holding tools in the tool case are spaced apart in a first direction and include holding regions with adsorption holes corresponding to substrate units and ball pads.
• Insertion blocks are placed between adjacent holding tools, with varying distances from the center of the tool case.
• The design ensures precise placement of solder balls on the substrate strip.

Potential Applications: - Electronics manufacturing - Semiconductor industry - Printed circuit board assembly

Problems Solved: - Accurate and efficient attachment of solder balls to substrate units - Consistent placement of solder balls on ball pads

Benefits: - Improved manufacturing process efficiency - Enhanced product quality and reliability - Cost-effective production

Commercial Applications: Title: Precision Ball Attachment Apparatus for Electronics Manufacturing This technology can be utilized in industries requiring precise solder ball attachment, such as electronics manufacturing and semiconductor production. The apparatus offers a reliable and efficient solution for attaching solder balls to substrate units, improving overall product quality and manufacturing efficiency.

Questions about Ball Attachment Apparatus: 1. How does the ball attachment apparatus improve the manufacturing process? The ball attachment apparatus ensures accurate and efficient attachment of solder balls to substrate units, leading to improved product quality and manufacturing efficiency.

2. What are the potential applications of the ball attachment apparatus? The ball attachment apparatus can be used in various industries such as electronics manufacturing, semiconductor production, and printed circuit board assembly for precise solder ball attachment.

Original Abstract Submitted

a ball attachment apparatus includes a tool case having a bottom surface on which solder balls are adsorbed for attachment to a substrate strip including a plurality of substrate units, a plurality of holding tools in the tool case spaced apart from each other in a first direction, including a plurality of holding regions disposed in the tool case each including adsorption holes, the holding regions respectively corresponding to the substrate units and the adsorption holes respectively corresponding to ball pads of the substrate units, and a plurality of insertion blocks respectively disposed between adjacent ones of the holding tools, wherein, among gaps between the holding tools, a first gap at a first distance from a center of the tool case is different from at least one second gap at a second distance greater than the first distance from the center of the tool case.