18783666. PRINTED CIRCUIT BOARD (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
PRINTED CIRCUIT BOARD
Organization Name
SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor(s)
PRINTED CIRCUIT BOARD
This abstract first appeared for US patent application 18783666 titled 'PRINTED CIRCUIT BOARD
Original Abstract Submitted
A printed circuit board includes a wiring portion including one or more insulating layers, one or more wiring layers respectively disposed on or in the one or more insulating layers, a first pad disposed on a lowermost insulating layer, of the one or more insulating layers, and a second pad disposed on an uppermost insulating layer, of the one or more insulating layers, a first solder resist layer disposed on a lower side of the wiring portion to cover at least a portion of the first pad, the first solder resist layer having a first opening, on the first pad, a second solder resist layer disposed on an upper side of the wiring portion to cover at least a portion of the second pad, a first surface treatment layer disposed on at least a portion of the first pad, and a barrier layer disposed on the first solder resist layer.
