18805678. COMPONENT-ATTACHED FPC MANUFACTURING METHOD (Yazaki Corporation)
COMPONENT-ATTACHED FPC MANUFACTURING METHOD
Organization Name
Inventor(s)
Hidehiko Shimizu of Makinohara-shi (JP)
COMPONENT-ATTACHED FPC MANUFACTURING METHOD
This abstract first appeared for US patent application 18805678 titled 'COMPONENT-ATTACHED FPC MANUFACTURING METHOD
Original Abstract Submitted
A component-attached FPC manufacturing method for manufacturing a component-attached FPC in which a circuit component is solder-bonded to an FPC, includes an FPC forming step of forming an FPC that integrally includes an FPC body, an FPC arm portion branching off from the FPC body, a component mounting portion provided on an end portion of the FPC arm portion and on which the circuit component is mounted, and a bridge connecting the component mounting portion and the FPC body, a component mounting step of mounting the circuit component on the component mounting portion via a solder, and an implementing step of heating the FPC, melting the solder, and implementing the circuit component on the component mounting portion.