CONTROL BOARD AND METHOD FOR MANUFACTURING SAME

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CONTROL BOARD AND METHOD FOR MANUFACTURING SAME

This abstract first appeared for US patent application 18633698 titled 'CONTROL BOARD AND METHOD FOR MANUFACTURING SAME

Original Abstract Submitted

A fracture due to crack growth occurring in a solder bonding portion of a wiring board of a control board in a quantum computer operating in a low-temperature environment can be prevented. There is provided a control board in which a chip electronic component having a plurality of electrodes formed thereon is connected to, by solder bonding portions, a wiring board having a wiring pattern and soldering pads formed on a front surface thereof. On the electrodes, after soldering, corner portions of the electrodes on the wiring board and entire lower surfaces thereof are covered with solder bonding portions, and corner portions of the pads on a side close to the electronic component and entire upper surfaces thereof are covered with the solder bonding portions.