18894586. BRIDGE INTERCONNECTION WITH LAYERED INTERCONNECT STRUCTURES (Intel Corporation)
BRIDGE INTERCONNECTION WITH LAYERED INTERCONNECT STRUCTURES
Organization Name
Inventor(s)
Qinglei Zhang of Chandler AZ (US)
Amanda E. Schuckman of Scottsdale AZ (US)
BRIDGE INTERCONNECTION WITH LAYERED INTERCONNECT STRUCTURES
This abstract first appeared for US patent application 18894586 titled 'BRIDGE INTERCONNECTION WITH LAYERED INTERCONNECT STRUCTURES
Original Abstract Submitted
Embodiments of the present disclosure are directed towards techniques and configurations for layered interconnect structures for bridge interconnection in integrated circuit assemblies. In one embodiment, an apparatus may include a substrate and a bridge embedded in the substrate. The bridge may be configured to route electrical signals between two dies. An interconnect structure, electrically coupled with the bridge, may include a via structure including a first conductive material, a barrier layer including a second conductive material disposed on the via structure, and a solderable material including a third conductive material disposed on the barrier layer. The first conductive material, the second conductive material, and the third conductive material may have different chemical composition. Other embodiments may be described and/or claimed.