DECOUPLING CAPACITOR BOOSTER MODULE

Organization Name

intel corporation

Inventor(s)

Herh Nan Chen of Georgetown (MY)

Kean Huat Leong of Georgetown (MY)

Sze Lin Mak of Pulau Pinang (MY)

Muhammad Danial Asyraf Abd Rahman of Kedah (MY)

DECOUPLING CAPACITOR BOOSTER MODULE - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240260193 titled 'DECOUPLING CAPACITOR BOOSTER MODULE

The abstract describes a patent application for a decoupling capacitor module that includes capacitors attached to a substrate, which is then attached to a motherboard with vertically aligned capacitors.

Simplified Explanation:

- The patent application is for a decoupling capacitor module with capacitors attached to a substrate. - The substrate is then attached to a motherboard with vertically aligned capacitors.

Key Features and Innovation:

- Decoupling capacitor module with capacitors attached to a substrate. - Vertically aligned capacitors on the substrate and motherboard.

Potential Applications:

- Microelectronic devices and systems. - Coreless or cored microelectronics boards.

Problems Solved:

- Improved decoupling capacitor module design. - Efficient use of space in microelectronic devices.

Benefits:

- Enhanced performance of microelectronic devices. - Better power distribution and noise reduction.

Commercial Applications:

- Potential use in various microelectronic devices. - Market implications in the electronics industry.

Questions about Decoupling Capacitor Module:

1. How does the vertically aligned capacitors improve performance? - The vertically aligned capacitors provide better power distribution and noise reduction in microelectronic devices.

2. What are the potential applications of this technology? - This technology can be used in various microelectronic devices to enhance their performance.

Original Abstract Submitted

microelectronic devices and systems include a decoupling capacitor module having any number of capacitors attached to a surface of a substrate such as a cored or coreless microelectronics board. the decoupling capacitor module is attached, by an opposing surface of the substrate, to a number of capacitors that are, in turn, mounted on a board such as a motherboard. substrate mounted capacitors are vertically aligned with corresponding board mounted capacitors to provide vertically stacked capacitors.