Intel corporation (20250113428). TECHNOLOGIES FOR AN ELECTROMAGNETIC INTERFERENCE SHIELD
TECHNOLOGIES FOR AN ELECTROMAGNETIC INTERFERENCE SHIELD
Organization Name
Inventor(s)
Tin Poay Chuah of Bayan Lepas MY
Kavitha Nagarajan of Bangalore IN
Telesphor Kamgaing of Chandler AZ US
Poh Boon Khoo of Bayan Lepas MY
TECHNOLOGIES FOR AN ELECTROMAGNETIC INTERFERENCE SHIELD
This abstract first appeared for US patent application 20250113428 titled 'TECHNOLOGIES FOR AN ELECTROMAGNETIC INTERFERENCE SHIELD
Original Abstract Submitted
technologies for a shield for electromagnetic interference include a circuit board with an integrated circuit package on it, with a hole in the circuit board under the integrated circuit package. the integrated circuit package may include one or more dies or other components on the underside of the package, at least partially positioned in the hole in the circuit board. an electromagnetic shield box can be positioned in the hole. tabs of the electromagnetic shield box may interface with pads on the same side of the circuit board as the integrated circuit package. the electromagnetic shield box may prevent or reduce electromagnetic or radiofrequency interference on the components of the integrated circuit package. positioning the electromagnetic shield box can reduce the overall height of the circuit board, among other advantages.