Intel corporation (20240260193). DECOUPLING CAPACITOR BOOSTER MODULE
DECOUPLING CAPACITOR BOOSTER MODULE
Organization Name
Inventor(s)
Herh Nan Chen of Georgetown MY
Kean Huat Leong of Georgetown MY
Sze Lin Mak of Pulau Pinang MY
Muhammad Danial Asyraf Abd Rahman of Kedah MY
DECOUPLING CAPACITOR BOOSTER MODULE
This abstract first appeared for US patent application 20240260193 titled 'DECOUPLING CAPACITOR BOOSTER MODULE
Original Abstract Submitted
microelectronic devices and systems include a decoupling capacitor module having any number of capacitors attached to a surface of a substrate such as a cored or coreless microelectronics board. the decoupling capacitor module is attached, by an opposing surface of the substrate, to a number of capacitors that are, in turn, mounted on a board such as a motherboard. substrate mounted capacitors are vertically aligned with corresponding board mounted capacitors to provide vertically stacked capacitors.