ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREFOR

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Inventor(s)

ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREFOR - A simplified explanation of the abstract

This abstract first appeared for US patent application 18432807 titled 'ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREFOR

Simplified Explanation

The abstract describes an electronic device with an injection mold, plated wiring, and an electronic element mounted on the mold.

The injection mold includes a mounting part and a wiring groove.
Plated wiring is plated on the wiring groove.
The electronic element is mounted on the mounting part and electrically connected to the plated wiring.
The plated wiring is on the outer region of the injection mold.
The electronic element is dispensed on the plated wiring.

Potential Applications

This technology could be applied in the manufacturing of electronic devices, such as smartphones, tablets, or smart home devices.

Problems Solved

This technology solves the problem of efficiently integrating electronic elements onto injection molds, reducing the need for additional wiring and connections.

Benefits

The benefits of this technology include simplified manufacturing processes, improved electrical connections, and potentially reduced production costs.

Potential Commercial Applications

The potential commercial applications of this technology could be in the consumer electronics industry, automotive industry, or any other industry that utilizes electronic components in their products.

Possible Prior Art

One possible prior art could be the use of traditional wiring methods for connecting electronic elements on injection molds, which may be more complex and time-consuming compared to the plated wiring method described in this patent application.

Unanswered Questions

How does this technology impact the overall durability of the electronic device?

The durability of the electronic device could be affected by the quality of the plated wiring and the connection between the electronic element and the wiring.

What are the potential challenges in scaling up this technology for mass production?

Scaling up this technology for mass production may pose challenges in terms of ensuring consistent quality control, optimizing production efficiency, and managing costs associated with the plated wiring process.

Original Abstract Submitted

An electronic device includes an injection mold including a mounting part and a wiring groove, a plated wiring plated on the wiring groove, and an electronic element mounted on the mounting part and electrically connected to the plated wiring, wherein the plated wiring is plated on an outer region of the injection mold, and the electronic element mounted on the injection mold dispensed on the plated wiring.