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Category:H01L23/66
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Pages in category "H01L23/66"
The following 200 pages are in this category, out of 228 total.
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- 17461957. PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 17742862. SEMICONDUCTOR PACKAGE AND PACKAGE-ON-PACKAGE INCLUDING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 17808221. ELECTROMAGNETIC WAVEGUIDING THROUGH LIQUID COOLING CONDUIT simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 17844802. SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17848059. INTEGRATED CIRCUIT PACKAGE WITH PSEUDO-STRIPLINE ARCHITECTURE simplified abstract (Intel Corporation)
- 17850187. SEMICONDUCTOR DEVICE WITH MULTIPLE DIES simplified abstract (Texas Instruments Incorporated)
- 17851026. PHASE-CHANGE MATERIAL (PCM) RADIO FREQUENCY (RF) SWITCHING DEVICE WITH AIR GAP simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 17856394. PLANAR T-COIL AND INTEGRATED CIRCUIT INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17884484. THROUGH-SUBSTRATE CONNECTIONS FOR RECESSED SEMICONDUCTOR DIES simplified abstract (Micron Technology, Inc.)
- 17932788. ON-CHIP HYBRID ELECTROMAGNETIC INTERFERENCE (EMI) SHIELDING WITH THERMAL MITIGATION simplified abstract (QUALCOMM Incorporated)
- 17937474. PACKAGE SUBSTRATE WITH OPEN AIR GAP STRUCTURES simplified abstract (Intel Corporation)
- 17937519. PACKAGE ARCHITECTURE WITH DIE-TO-DIE COUPLING USING GLASS INTERPOSER simplified abstract (Intel Corporation)
- 17956798. SEMICONDUCTOR PACKAGES WITH DIRECTIONAL ANTENNAS simplified abstract (TEXAS INSTRUMENTS INCORPORATED)
- 17957752. PHOTONICALLY STEERED IMPEDANCE SURFACE ANTENNAS simplified abstract (Intel Corporation)
- 17981176. DEVICE COMPRISING MULTI-DIRECTIONAL ANTENNAS IN SUBSTRATES COUPLED THROUGH FLEXIBLE INTERCONNECTS simplified abstract (QUALCOMM Incorporated)
- 18060125. INTEGRATED CIRCUIT PACKAGES INCLUDING A GLASS CORE WITH A FILTER STRUCTURE simplified abstract (Intel Corporation)
- 18061763. Semiconductor package with an antenna substrate simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18072026. Slot Bow-Tie Antenna On Package simplified abstract (TEXAS INSTRUMENTS INCORPORATED)
- 18088545. GALLIUM NITRIDE (GAN) DEVICES WITH THROUGH-SILICON VIAS simplified abstract (Intel Corporation)
- 18089417. INTERCONNECT DEVICE AND METHOD simplified abstract (Intel Corporation)
- 18146886. SYSTEM, ELECTRONIC DEVICE AND PACKAGE WITH VERTICAL TO HORIZONTAL SUBSTRATE INTEGRATED WAVEGUIDE TRANSITION AND HORIZONTAL GROUNDED COPLANAR WAVEGUIDE TRANSITION simplified abstract (Texas Instruments Incorporated)
- 18149026. Interposers with Millimeter-Wave Transitions simplified abstract (NXP B.V.)
- 18156847. SEMICONDUCTOR DIE PACKAGE AND METHODS OF FORMATION simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18187001. THREE-DIMENSIONAL POWER COMBINERS simplified abstract (Intel Corporation)
- 18215480. MICROSTRIP ROUTING ON EMBEDDED HIGH-K DIELECTRIC (Intel Corporation)
- 18253954. DEVICE-TO-DEVICE COMMUNICATION SYSTEM, PACKAGES, AND PACKAGE SYSTEM simplified abstract (Intel Corporation)
- 18260810. INTEGRATED CIRCUIT SUPPORTS WITH MICROSTRIPS simplified abstract (Intel Corporation)
- 18284861. PRINTED CIRCUIT BOARD simplified abstract (Mitsubishi Electric Corporation)
- 18296786. TRANSISTOR WITH SOURCE MANIFOLD IN NON-ACTIVE DIE REGION simplified abstract (NXP USA, Inc.)
- 18341916. AMPLIFIER AND MIXER IN A III-V MATERIAL FOR WIDEBAND SUB-TERAHERTZ COMMUNICATION (Intel Corporation)
- 18342112. Integrated Waveguides for Semiconductor Technology (Intel Corporation)
- 18349024. SEMICONDUCTOR PACKAGE simplified abstract (ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE)
- 18373357. WIDE BANDGAP TRANSISTOR LAYOUT WITH DRAIN ON OUTER EDGE simplified abstract (SKYWORKS SOLUTIONS, INC.)
- 18373358. WIDE BANDGAP TRANSISTOR LAYOUT WITH FOLDED GATE simplified abstract (SKYWORKS SOLUTIONS, INC.)
- 18387128. Versatile Resonator Radiator for Phased Array Applications (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 18387801. DEVICES AND METHODS FOR ENHANCING INSERTION LOSS PERFORMNCE OF AN ANTENNA SWITCH simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18391914. SEMICONDUCTOR DEVICE AND POWER AMPLIFIER INCLUDING THE SAME simplified abstract (Samsung Electro-Mechanics Co., Ltd.)
- 18426153. SHIELDED RADIO-FREQUENCY DEVICES simplified abstract (SKYWORKS SOLUTIONS, INC.)
- 18430568. INTEGRATED FAN-OUT PACKAGE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18433228. METHODS RELATED TO DUAL-SIDED MODULE WITH LAND-GRID ARRAY (LGA) FOOTPRINT simplified abstract (SKYWORKS SOLUTIONS, INC.)
- 18438338. RADIO-FREQUENCY SWITCHING DEVICES HAVING IMPROVED VOLTAGE HANDLING CAPABILITY simplified abstract (SKYWORKS SOLUTIONS, INC.)
- 18444742. PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18448045. Antenna Effect Protection and Electrostatic Discharge Protection for Three-Dimensional Integrated Circuit simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18462909. CAPACITORS OF SEMICONDUCTOR DEVICE CAPABLE OF OPERATING IN HIGH FREQUENCY OPERATION ENVIRONMENT simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18466351. DEVICE PACKAGES WITH INTEGRATED MILLIMETER-WAVE REFLECTOR CAVITIES (NXP USA, Inc.)
- 18468536. INDUCTOR PERFORMANCE ENHANCEMENT USING AN OUTER, PERIPHERAL PATTERNED GROUND SHIELD (QUALCOMM Incorporated)
- 18470581. Electronic Device with Three-Dimensional On-Chip Inductors (Apple Inc.)
- 18484311. DEVICES AND METHODS RELATED TO STACK ASSEMBLY simplified abstract (SKYWORKS SOLUTIONS, INC.)
- 18502649. POWER DEVICE PROGNOSTICS WITH QUANTUM SENSING THROUGH 2-D MATERIALS (Toyota Jidosha Kabushiki Kaisha)
- 18502649. POWER DEVICE PROGNOSTICS WITH QUANTUM SENSING THROUGH 2-D MATERIALS (Toyota Motor Engineering & Manufacturing North America, Inc.)
- 18513376. PACKAGED MODULE WITH ANTENNA AND FRONT END INTEGRATED CIRCUIT simplified abstract (Skyworks Solutions, Inc.)
- 18516974. PACKAGE STRUCTURE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18519821. Antenna Apparatus and Fabrication Method simplified abstract (Infineon Technologies AG)
- 18523320. SEMICONDUCTOR DEVICE simplified abstract (Murata Manufacturing Co., Ltd.)
- 18530179. MICROELECTRONIC DEVICE PACKAGE INCLUDING ANTENNA AND SEMICONDUCTOR DEVICE simplified abstract (TEXAS INSTRUMENTS INCORPORATED)
- 18537651. FIELD-EFFECT TRANSISTORS WITH INTERLEAVED FINGER CONFIGURATION simplified abstract (SKYWORKS SOLUTIONS, INC.)
- 18541878. SEMICONDUCTOR PACKAGES WITH ANTENNAS simplified abstract (Intel Corporation)
- 18566330. POWER AMPLIFIER simplified abstract (Mitsubishi Electric Corporation)
- 18575631. ANTENNA STRUCTURE, ANTENNA MODULE, CHIP, AND ELECTRONIC DEVICE simplified abstract (Huawei Technologies Co., Ltd.)
- 18595729. POWER AMPLIFICATION HIGH-FREQUENCY CIRCUIT DEVICE simplified abstract (Mitsubishi Electric Corporation)
- 18598394. TRACKER MODULE, RADIO FREQUENCY SYSTEM, AND COMMUNICATION DEVICE simplified abstract (Murata Manufacturing Co., Ltd.)
- 18603779. INTEGRATED CIRCUIT PACKAGES simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18604590. MILLIMETER WAVE ANTENNA TUNER simplified abstract (QUALCOMM Incorporated)
- 18614965. MODULE simplified abstract (Murata Manufacturing Co., Ltd.)
- 18616212. METHOD OF FORMING PACKAGE STRUCTURE simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18637489. AMPLIFIER MODULES WITH POWER TRANSISTOR DIE AND PERIPHERAL GROUND CONNECTIONS simplified abstract (NXP USA, Inc.)
- 18647106. Heterogeneous Antenna in Fan-Out Package simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18653619. POWER MODULE, POWER CONVERSION DEVICE, AND VEHICLE simplified abstract (Huawei Digital Power Technologies Co., Ltd.)
- 18663089. SEMICONDUCTOR PACKAGE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18663697. METHODS OF FORMING SEMICONDUCTOR PACKAGES HAVING A DIE WITH AN ENCAPSULANT simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18664508. SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18674281. SWITCH CAPACITANCE CANCELLATION CIRCUIT simplified abstract (Murata Manufacturing Co., Ltd.)
- 18676360. HIGH ELECTRON MOBILITY TRANSISTOR, RADIO FREQUENCY TRANSISTOR, POWER AMPLIFIER, AND PREPARATION METHOD FOR HIGH ELECTRON MOBILITY TRANSISTOR simplified abstract (HUAWEI TECHNOLOGIES CO., LTD.)
- 18676612. SEMICONDUCTOR COMPONENT AND ELECTRONIC DEVICE simplified abstract (Huawei Technologies Co., Ltd.)
- 18706307. MOUNTING STRUCTURE (NIPPON TELEGRAPH AND TELEPHONE CORPORATION)
- 18734746. CAPACITOR DIE EMBEDDED IN PACKAGE SUBSTRATE FOR PROVIDING CAPACITANCE TO SURFACE MOUNTED DIE simplified abstract (Intel Corporation)
- 18735151. PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18784674. ELECTRONIC DEVICE (STMicroelectronics International N.V.)
- 18818540. CHIP, CHIP PREPARATION METHOD, RADIO FREQUENCY POWER AMPLIFIER, AND TERMINAL (Huawei Technologies Co., Ltd.)
- 18823149. SEMICONDUCTOR DEVICE, WIRELESS COMMUNICATION DEVICE, AND METHOD FOR FABRICATING SEMICONDUCTOR DEVICE (Fujitsu Limited)
- 18887369. IC CHIP, RADIO FREQUENCY MODULE, AND COMMUNICATION DEVICE (Murata Manufacturing Co., Ltd.)
- 18887821. ELECTRICAL CONTACT CAVITY STRUCTURE AND METHODS OF FORMING THE SAME (Applied Materials, Inc.)
- 18888462. ELECTRONIC DEVICE (Innolux Corporation)
- 18895976. POWER AMPLIFIER SEMICONDUCTOR DEVICE (Nuvoton Technology Corporation Japan)
- 18921192. HIGH-FREQUENCY CIRCUIT COMPONENT (Murata Manufacturing Co., Ltd.)
- 18950589. WAVEGUIDE LAUNCHER IN PACKAGE BASED ON HIGH DIELECTRIC CONSTANT CARRIER (NXP USA, Inc.)
- 18966416. RADIO-FREQUENCY MODULE AND COMMUNICATION DEVICE (Murata Manufacturing Co., Ltd.)
- 18969430. Antenna Apparatus and Method (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18984922. ELECTRONIC DEVICE (InnoLux Corporation)
- 19007957. ELECTRONIC PACKAGE INCLUDING LEAD FRAME HAVING MULTIPLE CONDUCTIVE POSTS (SILICONWARE PRECISION INDUSTRIES CO., LTD.)
- 19009248. INTEGRATED CIRCUIT DEVICE INCLUDING METAL-OXIDE SEMICONDUCTOR TRANSISTORS (SAMSUNG ELECTRONICS CO., LTD.)
- 19015443. RADIO-FREQUENCY SWITCHING DEVICES HAVING IMPROVED VOLTAGE HANDLING CAPABILITY (SKYWORKS SOLUTIONS, INC.)
- 19017774. DEVICES AND METHODS RELATED TO RADIO-FREQUENCY FILTERS ON SILICON-ON-INSULATOR SUBSTRATE (SKYWORKS SOLUTIONS, INC.)
- 19018452. Transient Stabilized SOI FETs (pSemi Corporation)
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- Huawei technologies co., ltd. (20240313069). SEMICONDUCTOR COMPONENT AND ELECTRONIC DEVICE simplified abstract
- Huawei technologies co., ltd. (20240313388). ANTENNA STRUCTURE, ANTENNA MODULE, CHIP, AND ELECTRONIC DEVICE simplified abstract
- Huawei technologies co., ltd. (20240322029). HIGH ELECTRON MOBILITY TRANSISTOR, RADIO FREQUENCY TRANSISTOR, POWER AMPLIFIER, AND PREPARATION METHOD FOR HIGH ELECTRON MOBILITY TRANSISTOR simplified abstract
- Huawei technologies co., ltd. (20240421108). CHIP, CHIP PREPARATION METHOD, RADIO FREQUENCY POWER AMPLIFIER, AND TERMINAL
- Huawei Technologies Co., Ltd. patent applications on December 19th, 2024
- Huawei Technologies Co., Ltd. patent applications on September 19th, 2024
- HUAWEI TECHNOLOGIES CO., LTD. patent applications on September 26th, 2024
- HYUNDAI MOTOR COMPANY patent applications on June 6th, 2024
I
- Innolux corporation (20250132272). ELECTRONIC DEVICE
- Innolux Corporation patent applications on April 24th, 2025
- Intel corporation (20240113006). PACKAGE ARCHITECTURE WITH DIE-TO-DIE COUPLING USING GLASS INTERPOSER simplified abstract
- Intel corporation (20240113049). PACKAGE SUBSTRATE WITH OPEN AIR GAP STRUCTURES simplified abstract
- Intel corporation (20240113052). SEMICONDUCTOR PACKAGES WITH ANTENNAS simplified abstract
- Intel corporation (20240120651). PHOTONICALLY STEERED IMPEDANCE SURFACE ANTENNAS simplified abstract
- Intel corporation (20240178162). INTEGRATED CIRCUIT PACKAGES INCLUDING A GLASS CORE WITH A FILTER STRUCTURE simplified abstract
- Intel corporation (20240213118). GALLIUM NITRIDE (GAN) DEVICES WITH THROUGH-SILICON VIAS simplified abstract
- Intel corporation (20240213163). INTERCONNECT DEVICE AND METHOD simplified abstract
- Intel corporation (20240258296). MICROELECTRONIC ASSEMBLIES
- Intel corporation (20240258296). MICROELECTRONIC ASSEMBLIES simplified abstract
- Intel corporation (20240266745). MICROELECTRONIC DEVICES DESIGNED WITH MOLD PATTERNING TO CREATE PACKAGE-LEVEL COMPONENTS FOR HIGH FREQUENCY COMMUNICATION SYSTEMS simplified abstract
- Intel corporation (20240274521). METHODS AND APPARATUS TO REDUCE IMPEDANCE DISCONTINUITIES AND CROSSTALK IN INTEGRATED CIRCUIT PACKAGES simplified abstract
- Intel corporation (20240321785). CAPACITOR DIE EMBEDDED IN PACKAGE SUBSTRATE FOR PROVIDING CAPACITANCE TO SURFACE MOUNTED DIE simplified abstract
- Intel corporation (20240322775). THREE-DIMENSIONAL POWER COMBINERS simplified abstract
- Intel corporation (20240356198). INTEGRATED CIRCUIT PACKAGES, ANTENNA MODULES, AND COMMUNICATION DEVICES simplified abstract
- Intel corporation (20250006666). MICROSTRIP ROUTING ON EMBEDDED HIGH-K DIELECTRIC
- Intel corporation (20250006667). AMPLIFIER AND MIXER IN A III-V MATERIAL FOR WIDEBAND SUB-TERAHERTZ COMMUNICATION
- Intel Corporation (20250006667). AMPLIFIER AND MIXER IN A III-V MATERIAL FOR WIDEBAND SUB-TERAHERTZ COMMUNICATION
- Intel corporation (20250006668). Integrated Waveguides for Semiconductor Technology
- Intel Corporation patent applications on April 11th, 2024
- Intel Corporation patent applications on April 4th, 2024
- Intel Corporation patent applications on August 15th, 2024
- Intel Corporation patent applications on August 1st, 2024
- Intel Corporation patent applications on August 8th, 2024
- Intel Corporation patent applications on January 18th, 2024
- Intel Corporation patent applications on January 25th, 2024
- Intel Corporation patent applications on January 2nd, 2025
- Intel Corporation patent applications on June 27th, 2024
- Intel Corporation patent applications on March 14th, 2024
- Intel Corporation patent applications on May 30th, 2024
- Intel Corporation patent applications on October 24th, 2024
- Intel Corporation patent applications on September 26th, 2024
- International business machines corporation (20250149794). Versatile Resonator Radiator for Phased Array Applications
- International Business Machines Corporation patent applications on March 6th, 2025
- INTERNATIONAL BUSINESS MACHINES CORPORATION patent applications on May 8th, 2025
M
- Micron Technology, Inc. patent applications on February 15th, 2024
- Mitsubishi electric corporation (20240282725). POWER AMPLIFIER simplified abstract
- Mitsubishi electric corporation (20240413799). HIGH FREQUENCY AMPLIFIER AND MATCHING CIRCUIT
- Mitsubishi Electric Corporation patent applications on August 22nd, 2024
- Mitsubishi Electric Corporation patent applications on December 12th, 2024
- Murata manufacturing co., ltd. (20240313714). TRACKER MODULE, RADIO FREQUENCY SYSTEM, AND COMMUNICATION DEVICE simplified abstract
- Murata manufacturing co., ltd. (20240313772). SWITCH CAPACITANCE CANCELLATION CIRCUIT simplified abstract
- Murata manufacturing co., ltd. (20250015020). IC CHIP, RADIO FREQUENCY MODULE, AND COMMUNICATION DEVICE
- Murata manufacturing co., ltd. (20250149472). HIGH-FREQUENCY CIRCUIT COMPONENT
- Murata Manufacturing Co., Ltd. patent applications on January 9th, 2025
- Murata Manufacturing Co., Ltd. patent applications on May 8th, 2025
- Murata Manufacturing Co., Ltd. patent applications on September 19th, 2024
N
Q
- Qualcomm incorporated (20240096817). ON-CHIP HYBRID ELECTROMAGNETIC INTERFERENCE (EMI) SHIELDING WITH THERMAL MITIGATION simplified abstract
- Qualcomm incorporated (20240222872). MILLIMETER WAVE ANTENNA TUNER simplified abstract
- Qualcomm incorporated (20250096116). INDUCTOR PERFORMANCE ENHANCEMENT USING AN OUTER, PERIPHERAL PATTERNED GROUND SHIELD
- QUALCOMM Incorporated patent applications on February 6th, 2025
- QUALCOMM Incorporated patent applications on January 18th, 2024
- QUALCOMM Incorporated patent applications on July 4th, 2024
- QUALCOMM Incorporated patent applications on March 20th, 2025
- QUALCOMM Incorporated patent applications on March 21st, 2024
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- Samsung electronics co., ltd. (20240291446). BULK COMPLEMENTARY METAL-OXIDE SEMICONDUCTOR RADIO FREQUENCY SWITCH WITH ENHANCED RADIO FREQUENCY POWER HANDLING simplified abstract
- Samsung electronics co., ltd. (20250142947). INTEGRATED CIRCUIT DEVICE INCLUDING METAL-OXIDE SEMICONDUCTOR TRANSISTORS
- Samsung Electronics Co., Ltd. patent applications on August 29th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on August 29th, 2024
- Samsung Electronics Co., Ltd. patent applications on February 6th, 2025
- Samsung Electronics Co., Ltd. patent applications on May 1st, 2025
- SAMSUNG ELECTRONICS CO., LTD. patent applications on May 1st, 2025
- SK hynix Inc. patent applications on January 18th, 2024
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- Taiwan semiconductor manufacturing co., ltd. (20240128635). SEMICONDUCTOR PACKAGES AND MANUFACTURING METHODS THEREOF simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240162172). SEMICONDUCTOR DIE PACKAGE AND METHODS OF FORMATION simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240194619). PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240222307). INTEGRATED CIRCUIT PACKAGES simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20250096167). Antenna Apparatus and Method
- Taiwan Semiconductor manufacturing Co., Ltd. patent applications on April 18th, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on January 25th, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on July 4th, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on June 13th, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on March 20th, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on May 16th, 2024
- Taiwan semiconductor manufacturing company, ltd. (20240120639). Antenna Effect Protection and Electrostatic Discharge Protection for Three-Dimensional Integrated Circuit simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240213186). INTEGRATED FAN-OUT PACKAGE simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240234329). METHOD OF FORMING PACKAGE STRUCTURE simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240258287). PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Taiwan semiconductor manufacturing company, ltd. (20240258287). PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240297131). METHODS OF FORMING SEMICONDUCTOR PACKAGES HAVING A DIE WITH AN ENCAPSULANT simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240297432). Heterogeneous Antenna in Fan-Out Package simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240304561). SEMICONDUCTOR PACKAGE simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240304572). SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240321786). PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240379519). SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF simplified abstract